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Method for improving passive intermodulation of microwave device

A microwave device and passive intermodulation technology, which is applied to waveguide devices, electrical components, circuits, etc., can solve the problems of deteriorating passive intermodulation performance and poor thermal conductivity of microwave passive devices, and achieve improved passive intermodulation performance , take into account the cost, improve the effect of surface smoothness

Inactive Publication Date: 2012-07-04
FUJIAN SUNNADA COMM
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Problems solved by technology

This layer of metal oxide can improve the corrosion resistance of microwave passive devices, but the thermal conductivity of this layer of metal oxide is very poor, and it does not conduct electricity at room temperature, which will deteriorate the passive intermodulation performance of microwave passive devices

Method used

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  • Method for improving passive intermodulation of microwave device
  • Method for improving passive intermodulation of microwave device

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Embodiment Construction

[0021] see figure 1 As shown, the embodiments of the present invention will be described in detail.

[0022] A kind of method for improving the passive intermodulation of microwave device of the present invention, emphases are to be present in the metal oxide on the combination surface of each component of microwave device to remove, and cover the contact resistance of any two points on the surface of the upper layer to be less than 20mΩ (i.e. conductivity good) and corrosion-resistant alternative substance layers.

[0023] Conductive oxidation treatment can be used for the treatment of metal oxides on the combined surfaces of the components of the microwave device of the present invention (such as the contact surface between the connector and the shell, the contact surface between the shell and the cover plate, the contact surface between the connector and the cover plate, etc.), such as chromium Salt treatment method. The basic process flow of the chromate treatment method...

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Abstract

The invention provides a method for improving passive intermodulation of a microwave device, which includes removing metal oxide on the mutual combination faces of assemblies of the microwave device and covering a corrosion resistant replacement material layer to enable contact resistance of any two points on the surface to be smaller than 20 micro omegas. The processing technology of the metal oxide on the mutual combination faces of the assemblies of the microwave device can adopt conductive oxidation processing like a chromate processing method. The basic processes of the chromate processing method are as follows: chemical degreasing- washing-degreasing-bright dipping-scrubbing-chromate processing-washing-drying-stoving. The method changes a metal injection molding (MIM) structure, removes insulation materials (the metal oxide) in the MIM structure and then forms a film with conductivity and corrosion resistance. Therefore, passive intermodulation performance of the microwave passive device can be improved under the condition that surface smoothness is poor while cost, work time and energy consumption are all considered.

Description

【Technical field】 [0001] The invention relates to the field of microwave devices, in particular to a method for improving passive intermodulation of microwave devices. 【Background technique】 [0002] Microwave passive components include shells, connectors, and cover plates. In modern communication systems, passive intermodulation distortion occurs when microwave signals of two or more frequencies meet in microwave passive devices. Microwave passive components such as antennas, cables, filters, combiners, duplexers, couplers, etc., due to unreliable mechanical connections, materials with hysteresis characteristics, contact surface contamination, etc., signals of different frequencies Nonlinear frequency mixing at the device connection produces intermodulation products of different amplitudes, and these intermodulation distortion signals appear as interference signals in the communication frequency band, which reduces the signal-to-noise ratio of the system and seriously affe...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01P11/00
Inventor 张吓弟黄海峰林轶樑
Owner FUJIAN SUNNADA COMM
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