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Molded object, method of producing the same, sealed molded object, polymer, and optical information recording medium

A molding and recording layer technology, applied in optical recording/reproduction, optical recording carrier, information storage, etc., can solve problems such as slow progress and achieve high dimensional accuracy

Inactive Publication Date: 2012-07-11
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in many cases, by merely mixing these ingredients, the progress of the reaction is slow, therefore, it is desirable to add an accelerator to catalytically accelerate the curing reaction

Method used

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  • Molded object, method of producing the same, sealed molded object, polymer, and optical information recording medium
  • Molded object, method of producing the same, sealed molded object, polymer, and optical information recording medium
  • Molded object, method of producing the same, sealed molded object, polymer, and optical information recording medium

Examples

Experimental program
Comparison scheme
Effect test

no. 1 approach

[0022] 1. First Embodiment (Example of Molded Article and Manufacturing Method Thereof)

no. 2 approach

[0023] 2. Second Embodiment (Example of Optical Information Recording Medium and Manufacturing Method Thereof)

[0024] [1. First Embodiment]

[0025] (molding)

[0026] The molding is obtained by curing a curable composition comprising a silicon analogue having one or more epoxy groups and an alpha-hydroxy acid. Specifically, the molded article is a polymer obtained by polymerizing a silicon analog having one or more epoxy groups using protons derived from an α-hydroxy acid as an initiator. The polymerization is ring-opening polymerization in which the epoxy group of the silicon analog is ring-opened and polymerized. Preferably, the curable composition is a thermosetting composition to be cured by a thermal reaction. Here, the thermal reaction also includes a reaction that proceeds spontaneously in an environment at a temperature around room temperature. Near room temperature means a temperature range from 10°C to 40°C.

[0027] Also, the curable composition may be fille...

Embodiment 1-1 to 1-5

[0129] As shown in Table 2, epoxy-siloxane compound A as a silicone derivative and DL-lactic acid as a carboxylic acid are combined in a mass ratio of 10:1 to 60:1 to make compatibilized, Thus a thermosetting composition was prepared.

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Abstract

There are provided a molded object, a method of producing the same, a sealed molded object, a polymer, and an optical information recording medium, in each of which curing may be achieved at around room temperature in a short time without addition of an accelerator, and volumetric shrinkage accompanying the curing may be suppressed. The molded object is obtained by curing a curable composition containing a silicon analogue having one or more epoxy groups and an [alpha]-hydroxy acid.

Description

technical field [0001] The present invention relates to a molded article, a method for producing the molded article, a sealed molded article, a polymer, and an optical information recording medium. Specifically, the present invention relates to a molded article obtained by curing a silicon analog (silane compound) having an epoxy group. Background technique [0002] When curing the silicon analog having an epoxy group, a compound having an amino group, a thiol group, an acid anhydride group, a hydroxyl group, etc. is mixed therewith as a curing agent. However, in many cases, by merely mixing these ingredients, the progress of the reaction is slow, and therefore, it is desirable to add an accelerator to catalytically accelerate the curing reaction. As accelerators, there are known organic amine compounds, organic phosphorus compounds, borate esters, Lewis acids, organic metal compounds, organic acid metal salts, etc. (for example, see Japanese Unexamined Patent Application P...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08G59/20G11B7/245G11B7/26G11B7/24035
CPCG11B7/2533C08K5/5435C08L83/06C08G77/38
Inventor 齐藤则之
Owner SONY CORP
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