Laminated high-density optical module
An optical module, high-density technology, applied in the coupling of optical waveguide, etc., can solve the problem of copper wire electrical interconnection transmission distance limitation, etc., and achieve the effect of compact structure
Active Publication Date: 2014-04-02
NAT CENT FOR ADVANCED PACKAGING CO LTD
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Problems solved by technology
In the case of high bandwidth, the transmission distance of copper wire electrical interconnection is limited by factors such as signal loss and crosstalk
Method used
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[0014] Such as figure 1 As shown, the laminated high-density optical module provided by the embodiment of the present invention includes: a rigid printed circuit board 1a of the light-emitting part, a rigid printed circuit board 1b of the light-receiving part, a microcontroller 3a of the light-emitting part, a light-receiving part Part of the microcontroller 3b, multi-channel laser driver chip 4, laser array chip 5, detector array chip 6, multi-channel amplifier chip 7, flexible printed circuit board 8 and pad 9.
[0015] The light-emitting part and the light-receiving part can share a microcontroller, and the shared microcontroller can be surface-mounted on the rigid printed circuit board 1a of the light-emitting part, or can be surface-mounted on the rigid printed circuit of the light-receiving part On the board 1b; the light-emitting part and the light-receiving part can also adopt independent microcontrollers respectively, figure 1 Only the case where the light-emitting p...
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The invention discloses a laminated high-density optical module, which comprises rigid printed circuit boards, a flexible printed circuit board, microcontrollers, a multi-channel laser drive chip, a laser array chip, a detector array chip, a multi-channel amplifier chip, a cushion block and an optical fiber, wherein the rigid printed circuit board of a light emission part and the rigid printed circuit board of a light reception part are connected mutually through the flexible printed circuit board; the microcontrollers are arranged on the rigid printed circuit boards; the chips are arranged on the upper surface of the flexible printed circuit board in an inverse manner; the cushion block is adhered to the lower surface of the flexible printed circuit board; and the optical fiber is inserted into the through hole of the cushion block to realize optical coupling with the laser array chip and the detector array chip. Aiming at the limitation on the size of the board edges, the laminated high-density optical module provided by the invention has the advantages of a more compact structure and higher bandwidth of light reception and emission modules, a simple structure, high efficiency and low cost.
Description
technical field [0001] The invention belongs to the field of optical communication and optical interconnection, in particular to a laminated high-density optical module. Background technique [0002] Optical fiber communication has the advantages of high broadband, low loss, low bit error rate, high confidentiality, and high anti-interference. With the advancement of digitalization, the processing, storage and transmission of data has developed rapidly. The demand for high bandwidth makes short-distance interconnection the bottleneck of system development. In the case of high bandwidth, the transmission distance of copper wire electrical interconnection is limited by factors such as signal loss and crosstalk. Parallel optical interconnection connects multiple optical fibers for parallel transmission, and can achieve long-distance transmission at a high bit rate. It has the advantages of high broadband, low loss, low bit error rate, high confidentiality, and high anti-inte...
Claims
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IPC IPC(8): G02B6/42
Inventor 李宝霞
Owner NAT CENT FOR ADVANCED PACKAGING CO LTD