Vacuum package structure and vacuum packaging method for wafer-level MEMS (micro-electromechanical system) devices

Abstract

The invention relates to a vacuum package structure and a vacuum packaging method for wafer-level MEMS (micro-electromechanical system) devices. The vacuum package structure for wafer-level MEMS devices comprises a first wafer, an ASIC (application specific integrated circuit) is arranged on the front face of the first wafer, and a second wafer is disposed below the back of the first wafer. The back of the first wafer is provided with a recess, and an opening of the recess faces the second wafer. A getter activation structure is disposed in the recess and covers the recess and the back of the first wafer. Getter is disposed at the recess bottom of the recess. An MEMS structure is disposed on the second wafer and right below the getter. The first wafer and the second wafer are connected together by vacuum bonding. A vacuum cavity is formed between the first wafer and the second wafer. The MEMS structure is disposed in the vacuum cavity and electrically connected with the ASIC. The vacuum package structure is compact, the integration level of the vacuum package structure is increased, the production cost of the vacuum package structure is lowered, and the production efficiency of the vacuum package structure is improved.

Description

technical field [0001] The invention relates to a vacuum packaging structure and a packaging method, in particular to a vacuum packaging structure and a packaging method of a wafer-level MEMS device, belonging to the technical field of semiconductor packaging. Background technique [0002] MEMS micro-electro-mechanical system is a micro-electro-mechanical device or device including micro-sensors, micro-actuators (also known as micro-actuators), micro-energy and other micro-mechanical basic parts, and high-performance electronic integrated circuits. An integrated device for information and execution of mechanical operations. Usually, the mechanical parts of the ASIC chip and the MEMS chip are fabricated on two independent chips, and then combined through some special processes to form a MEMS device. The MEMS device realized by this method not only greatly reduces the degree of integration, but also increases the additional packaging area, which is not conducive to adapting t...

AI Technical Summary

Problems solved by technology

The MEMS device realized by this method not only greatly reduces the degree of integration, but also increases the additional packaging area, which is not conducive to adapting to the development trend of miniaturization of MEMS devices.

In response to this technical problem, researchers regard 3D packaging technology as a current research hotspot to effectively solve the problems of low integration and large packaging area.

[0003] At the same time, many MEMS devices, such as micro-accelerometers, micro-gyroscopes, etc., have movable structures or parts inside, and can only obtain good working performance when working in a vacuum environment. Therefore, certain challenges are raised for the packaging of the devices. , such as how to improve the efficiency of vacuum packaging while reducing packaging costs

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