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Reinforced polyamide composition with high liquidity and low warpage and preparation method and application thereof

A technology for polyamide composition and fluidity, which is applied in the field of reinforced polyamide composition and its preparation, can solve the problems of high cost, limited application and the like, and achieves the effects of small warpage, smooth injection molding surface and excellent fluidity

Active Publication Date: 2012-07-18
KINGFA SCI & TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the current production technology for glass fiber cross-sectional area flat ratio greater than 2 is limited to a few companies, and the cost is very expensive, which greatly limits the application of this method

Method used

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  • Reinforced polyamide composition with high liquidity and low warpage and preparation method and application thereof
  • Reinforced polyamide composition with high liquidity and low warpage and preparation method and application thereof

Examples

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Comparison scheme
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Embodiment 1-6 and comparative example 1-3

[0055] The raw materials of the polyamide compositions of Examples 1-6 and Comparative Examples 1-3 are shown in Table 1, and the preparation methods are the same. All raw materials (excluding glass fiber) are mixed uniformly at 280-320°C, then the mixture and glass fiber are put into a twin-screw extruder for melting and mixing, and the glass fiber is side-fed. The rotation speed of the extruder is 300 rpm, and the temperature of the screw barrel is 320°C. After the molten polymer is extruded from the extruder, it is quenched with water and pelletized.

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PUM

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Abstract

The invention discloses a reinforced polyamide composition with high liquidity and low warpage and a preparation method and application thereof. The reinforced polyamide composition is prepared from the following components in percentage by mass: 30 to 60 percent of polyamide, 40 to 70 percent of inorganic reinforcing filler and 0 to 20 percent of flame retardant, wherein the polyamide consists of semi-aromatic polyamide and fatty polyamide in a mass ratio of 10:(1-3). The reinforced polyamide composition with high liquidity and low warpage has high mechanical property, liquidity and dimensional stability, can replace metal and is suitable for a shell material of electronic consumer equipment and automobile parts, and an injection-molded surface is smooth and low in warpage.

Description

technical field [0001] The invention belongs to the field of modified plastics, and in particular relates to a reinforced polyamide composition with excellent fluidity and low warpage, a preparation method and application thereof. Background technique [0002] Polyamide resin has excellent mechanical strength, heat resistance, chemical resistance, wear resistance and self-lubrication, and low friction coefficient, it is widely used in electronic appliances, auto parts, furniture, building materials and fibers, etc. Has become one of the most important engineering plastics. [0003] Reinforced semi-aromatic polyamide resin has good mechanical properties and high heat distortion temperature, and is expected to replace metals in many applications, including telecommunications, consumer electronics, household appliances, and various motors and mechanical equipment materials for housing, interior and exterior parts of the automotive industry. Applications in these areas require...

Claims

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Application Information

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IPC IPC(8): C08L77/00C08L77/02C08L77/06C08K13/04C08K7/14C08K5/5313
Inventor 龙杰明姜苏俊曹民易庆锋陈健麦杰鸿严峡
Owner KINGFA SCI & TECH CO LTD
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