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Electroplating device and electroplating method thereof

An electroplating device and electroplating treatment technology, applied in the direction of electrolytic coating, etc., can solve the problems of unstable plating adhesion and continuity, short effective length of busbar, and influence on electroplating quality, so as to improve electroplating efficiency and quality, complete pickling, space-saving effect

Active Publication Date: 2012-07-18
昆山市宏泰机电设备有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electroplating is tin, nickel, silver and other metals on the surface of the busbar, which can prevent the oxidation of the busbar and increase its communication quality. The busbar conduction mechanism of the traditional electroplating device generally adopts rollers arranged horizontally in the electroplating tank to conduct the busbar. On the one hand, the busbar is in the The effective lengths in the degreasing tank, pickling tank and electroplating tank are short, and the busbar cannot be completely degreased and pickled, resulting in unstable plating adhesion and continuity, and the time of the busbar in the electroplating tank is also short. As a result, the coating is relatively thin; on the other hand, the horizontal rollers are likely to cause the solutions in adjacent tanks to flow together, affecting the quality of electroplating

Method used

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  • Electroplating device and electroplating method thereof
  • Electroplating device and electroplating method thereof
  • Electroplating device and electroplating method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0031] see figure 1 , figure 2 , image 3 , as described in the legend therein, an electroplating device for electroplating a busbar 1, including a degreasing system for removing oil stains on the surface of the busbar 1, and a first water washing and air-drying system for removing residues on the surface of the busbar 1 , a pickling system for removing oxides on the surface of the busbar 1, an electroplating system for electroplating the busbar 1, a second water washing and air-drying system for removing residues on the surface of the busbar 1, the degreasing system, the pickling system and the electroplating system are all equipped with multi-groove rollers 7 for conductively storing the busbar 1 .

[0032] The multi-groove roller 7 rotates along the horizontal plane around its axis.

[0033] A tension device 8 for pre-tensioning the busbar 1 is also provided between the multi-groove rollers 7 .

[0034] Preferably, the multi-grooved roller 7 is a spiral grooved roller....

Embodiment 2

[0059] The rest are the same as in the first embodiment, the difference is that the multi-grooved roller is a circumferential grooved roller

Embodiment 3

[0061]The rest is the same as that of Example 1, except that the pickling solution is a 10%-15% hydrochloric acid solution, and an appropriate amount of water or hydrochloric acid can be added according to the concentration of the pickling solution.

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Abstract

The invention discloses an electroplating device, which is used for electroplating a bus and comprises a degreasing system, a first water-washing air-drying system, an acid-washing system, an electroplating system and a second water-washing air-drying system. The degreasing system is used for removing greasy dirt on the surface of the bus, the first water-washing air-drying system is used for removing surface residue of the bus, the acid-washing system is used for removing surface oxide of the bus, the electroplating system is used for electroplating treatment, and the second water-washing air-drying system is used for removing surface residue of the bus. The invention further discloses an electroplating method of the electroplating device, and efficiency and effect of electroplating are improved.

Description

technical field [0001] The invention relates to an electroplating device, in particular to an electroplating device and an electroplating method thereof. Background technique [0002] Electroplating is tin, nickel, silver and other metals on the surface of the busbar, which can prevent the oxidation of the busbar and increase its communication quality. The busbar conduction mechanism of the traditional electroplating device generally adopts rollers arranged horizontally in the electroplating tank to conduct the busbar. On the one hand, the busbar is in the The effective lengths in the degreasing tank, pickling tank and electroplating tank are short, and the busbar cannot be completely degreased and pickled, resulting in unstable plating adhesion and continuity, and the time of the busbar in the electroplating tank is also short. The plating layer is relatively thin; on the other hand, the horizontally arranged rollers easily cause the solutions in adjacent tanks to flow toge...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C25D19/00C25D7/06
Inventor 谭礼春翟从根
Owner 昆山市宏泰机电设备有限公司
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