Method and apparatus for irradiating a photovoltaic material surface by laser energy
An irradiation, material layer technology, applied in photovoltaic power generation, sustainable manufacturing/processing, electrical components, etc., can solve the problems of increasing complexity, cost and change, expensive operation, difficult to control, etc., to improve the overall performance. Effect
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no. 1 approach
[0028] According to a first embodiment of the present invention, there is provided a method of manufacturing a TF-PV material, the method comprising:
[0029] - providing a layer of TF-PV material having a degree of crystallinity, and
[0030] - irradiating the surface area of the TF-PV material layer by means of a laser source with irradiation parameters,
[0031] It is characterized in that the irradiation parameters are chosen such that the crystallinity increases at least at the top layer of the surface area.
[0032] According to the present invention, short-duration localized heating by irradiating different parts of the TF-PV cell structure via laser irradiation can be used to selectively alter the physical, optical and electronic properties of the deposited film and thereby Improves the overall performance of the battery. In particular, a change in the crystalline, polycrystalline or amorphous structure present in different parts of the film can be induced.
[003...
Embodiment 1
[0054] a) depositing a TF absorber film comprising at least one layer of amorphous silicon, followed by
[0055] b) Partially recrystallize the amorphous silicon layer to produce a stack with different amorphous silicon / microcrystalline layers, whereby the explosive recrystallization effect is used to obtain recrystallization at depths well beyond the radiation absorption depth.
Embodiment 2
[0057] a) Applying a TCO (transparent conducting) layer (eg, sputtered ZnO) onto the TF absorber layer comprising at least one layer of amorphous silicon, followed by
[0058] b) Partially recrystallize the amorphous silicon layer to produce stacks with different amorphous silicon / microcrystalline layers, thereby exploiting the explosive recrystallization effect to depths well beyond both the radiation absorption depth and the non-explosive melting front depth Recrystallization is obtained at depth, while
[0059] c) Simultaneous heating of the overlying TCO layer during the irradiation step in order to improve the optical and electrical properties of the TCO film and to improve, ie reduce, the resistance of the TCO-semiconductor junction.
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