Optical measuring method for in-plane vibration of micro-electromechanical structure
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- TSINGHUA UNIV
- Publication Date
- 2014-06-18
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Abstract
Description
technical field
[0001] The invention belongs to the technical field of vibration measurement, in particular to an optical measurement method for in-plane vibration of a micromechanical structure. Background technique
[0002] The detection of MEMS devices is an important link in the production of MEMS devices, and the vibration measurement of the movable structure of MEMS devices is an important part of it. For the in-plane vibration of MEMS structures, the current measurement methods are still very limited, including heterodyne interferometry, stroboscopic image method, and differential Doppler method.
[0003] The heterodyne interferometry is to interfere the reflected beam of the MEMS structure with the reference beam, and measure the change of the interference fringe to measure the vibration of the MEMS structure; the differential Doppler method is to irradiate two beams of light with different incident angles to the MEMS device On the vibration structure, the Doppler e...