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Optical measuring method for in-plane vibration of micro-electromechanical structure

A micro-mechanical structure, optical measurement technology, applied in measurement devices, measurement of ultrasonic/sonic/infrasonic waves, instruments, etc., can solve the problem of high equipment cost, achieve the effects of low cost, broad market and application prospects, and simple optical path structure

Active Publication Date: 2014-06-18
TSINGHUA UNIV
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The disadvantage of this method is that precise synchronization technology is required, and the equipment cost is high

Method used

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  • Optical measuring method for in-plane vibration of micro-electromechanical structure
  • Optical measuring method for in-plane vibration of micro-electromechanical structure
  • Optical measuring method for in-plane vibration of micro-electromechanical structure

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Embodiment Construction

[0021] The invention provides an optical measurement method for in-plane vibration of a micromechanical structure. Be described below in conjunction with accompanying drawing.

[0022] figure 1 Shown is a schematic diagram of an optical measurement device firstly established. The structure of the device is to place a polarizer 2 and a dichroic prism 5 in sequence in front of the light source 1. The dichroic prism 5 is placed directly above the plane of the micromechanical device to be measured. When the light source 1 And the polarizer 2 is placed on the upper left or right of the plane of the micromechanical device to be tested, and when the coherent parallel light produced is irradiated obliquely with the plane of the micromechanical device, the dichroic prism 5 (such as figure 2 shown). A Fourier lens 6 is fixed above the beam-splitting prism 5, and a photodetector 7 is fixed on the upper right of the Fourier lens 6; the measured micromechanical device 4 is placed below ...

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Abstract

The invention discloses an optical measuring method for in-plane vibration of a micro-electromechanical structure, which belongs to the technical field of vibration measurement. Firstly, an optical measuring device is built and used for measuring the in-plane vibration of the micro-electromechanical structure, coherent parallel light irradiates a plane of a measured micro-electromechanical device through a beam splitter prism, reflected light on the plane is transmitted by the beam splitter prism to a score at the focus of a Fourier lens with optical Fourier characteristics, the spatial frequency spectrum of light intensity distribution of the reflected light on the plane of the micro-electromechanical device is formed, and the position and the vibration amplitude of the micro-electromechanical device are obtained by measuring the frequency of spectral line light intensity change in the spatial frequency spectrum and calculating Fourier transformation of spectral line light intensity. An optical path structure is simple, light beams do not need to be accurately gathered, and precise time synchronization technology is not needed. The requirements of large-scale assembly line production on product testing can be effectively met, and wide marketing and application prospects are realized.

Description

technical field [0001] The invention belongs to the technical field of vibration measurement, in particular to an optical measurement method for in-plane vibration of a micromechanical structure. Background technique [0002] The detection of MEMS devices is an important link in the production of MEMS devices, and the vibration measurement of the movable structure of MEMS devices is an important part of it. For the in-plane vibration of MEMS structures, the current measurement methods are still very limited, including heterodyne interferometry, stroboscopic image method, and differential Doppler method. [0003] The heterodyne interferometry is to interfere the reflected beam of the MEMS structure with the reference beam, and measure the change of the interference fringe to measure the vibration of the MEMS structure; the differential Doppler method is to irradiate two beams of light with different incident angles to the MEMS device On the vibration structure, the Doppler e...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01H9/00
Inventor 高永丰尤政曹良才
Owner TSINGHUA UNIV
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