Resin composition

A resin composition, resin technology, applied in the direction of layered products, metal layered products, printed circuit parts, etc.
CN102633952AActive Publication Date: 2012-08-15ELITE MATERIAL
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ELITE MATERIAL
Publication Date
2012-08-15

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Abstract

The invention relates to a resin composition, mainly comprising the following components in parts by weight: (1) 100 parts of epoxy resin; (2) 20-100 parts of vinyl compound; (3) 10-50 parts of styrene maleic anhydride; (4) 5-50 parts of benzoxazine; (5) 0.5-5 parts of adherence promoter; (6) 10-150 parts of inorganic filler; (7) 0.2-25 parts of peroxide; (8) 10-250 parts of phosphorus-containing fire retardant; and (9) 0.01-10 parts of catalyst.
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Description

technical field

[0001] The invention relates to a composition, in particular to a resin composition suitable for printed circuit boards. Background technique

[0002] Due to the popularity of cloud computing and the increasing application of high-speed transmission, the dielectric constant of the existing FR-4 substrates has gradually been unable to meet the existing needs. Generally speaking, materials with low dielectric constant are mainly used for high-frequency transmission printed circuit boards, insulation protection of electronic components, or laminated insulating films for lead frames. Since the aforementioned applications all involve the high temperature process of printed circuit boards, polyphenylene ether with low dielectric properties is often used for the low dielectric base layer. In addition, because epoxy resin has excellent electrical properties, mechanical strength and chemical resistance properties, and has a good bonding effect on copper foil, polyphe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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