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Sealed electronic housing and method for the sealed assembly of such a housing

An assembly method and housing technology, which are applied in the direction of electric solid devices, circuits, electrical components, etc., can solve the problems of complex devices and long manufacturing time, and achieve the effects of no equipment, easy implementation, and excellent mechanical strength.

Inactive Publication Date: 2012-08-15
THALES TOUR CARPE DIEM PLACE DES COROLLES ESPLANADE NORD COURBEVOIE
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the assembly of shells based on the formation of intermetallic compounds has the disadvantage that complex devices are required and the manufacturing time is long (several hours)

Method used

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  • Sealed electronic housing and method for the sealed assembly of such a housing
  • Sealed electronic housing and method for the sealed assembly of such a housing
  • Sealed electronic housing and method for the sealed assembly of such a housing

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] figure 1 The overall parallelepiped sealing the exterior of the electronic housing 2 of the first example of the housing according to the invention is shown in perspective. The sealed electronic housing 2 comprises a support 3 and a cover 5 arranged to form a pair of cavities 7 for housing electronic components 4 (these components are shown in figure 2 ) to define the wall, the electronic component 4 is fixed to the support 3 . The support 3 and the lid 5 are connected in a hermetic manner with a joint 6 comprising clusters of metal nanoparticles. The group has a mesoscopic structure.

[0040] figure 2 schematically shows the representation in figure 1 Section of the shell in vertical plane M. The electronic housing 2 comprises a cover 5 and a support 3 to which the electronic components 4 are fixed. exist figure 2 In the embodiment shown, the support 3 forms a base body in the shape of a plate as a whole. In addition, the support 3 has a substrate function, ...

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Abstract

The invention relates to a method for the sealed assembly of an electronic housing (2, 20, 200) containing one or more electronic components (4), including the following steps: a step (B) of assembling the housing (2, 20, 200) by contacting a substrate (3), to which the electronic component(s) (4) is (are) secured, and a cover (5) using a mixture (18) including a paste (19) and nanoparticles (17) suspended in said paste (19), the size of the nanoparticles ranging from 10 to 30 nm; a step (C) of closing the housing (2, 20, 200) in a sealed manner by means of heating said housing (2, 20, 200) to a temperature T for sintering the metal nanoparticles (17) between 150 DEG C and 180 DEG C while subjecting the housing to a pressure higher than 2.5 105 Pa.

Description

technical field [0001] The field of the invention relates to sealed electronic housings containing at least one electronic component within a cavity inside the housing. The role of the housing is important because it directly affects the performance and reliability of the electronic functions implemented by the electronic components it houses, as well as the cost and efficiency of manufacturing. The main function of the housing is to protect the electronic functions it contains from the external environment. The reliability of electronic components is sensitive to the gases present in the cavity and the relative humidity of the cavity. It is necessary to ensure a hermetic closure of the casing to protect the gas composition and relative humidity of the atmosphere, which is necessary for the correct operation of the encapsulated components (for example, when the casing is sealed, to prevent hydrogen from entering the casing, hydrogen entering can degrade chips made of gallium...

Claims

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Application Information

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IPC IPC(8): H01L21/50H01L23/10
CPCH01L23/10H01L2224/32225H01L2224/48227H01L2224/73265H01L2924/15192H01L2924/16195H01L2924/16251H01L2924/01327H01L2924/01322H01L2924/1461H01L24/73H01L21/50Y10T29/49146Y10T29/49147Y10T29/49144H01L2924/00012H01L2924/00
Inventor C·德勒冯O·旺迪耶W·贝纳塞
Owner THALES TOUR CARPE DIEM PLACE DES COROLLES ESPLANADE NORD COURBEVOIE
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