Burdening procedure for preparing mixed glue solution for copper foil-coated substrate
A copper-clad substrate and mixed glue technology is applied in the compounding process of preparing a mixed glue for copper-clad substrates, which can solve problems such as unstable glue, uneven dispersion of fillers, and pipeline blockage of batching equipment. Improve the uniformity of filler dispersion, avoid sedimentation and agglomeration, and enhance the effect of fusion
Active Publication Date: 2012-08-29
无锡宏仁电子材料科技有限公司
View PDF5 Cites 2 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
For the batching system that controls the order of adding single products, the traditional system is to add epoxy resin first, then add curing agent and solvent, stop stirring after stirring for 60 minutes, continue stirring for 360-420 minutes after adding filler, and finally add accelerator , the stability of the glue prepared by this kind of batching operation and the dispersibility of the filler are relatively poor. First, adding the filler when the stirring is stopped will easily cause the filler to settle and cause the pipeline of the batching equipment to be blocked; secondly, if the filler is added, if the Failure to stir in time will cause the filler to agglomerate, resulting in uneven dispersion of the filler in the glue solution and unstable glue solution
Therefore, the mixed glue prepared by the traditional operating system will lead to unstable performance of the printed circuit board due to the poor stability of the glue and uneven dispersion of fillers.
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0015] Refer to the batching flow chart to describe the specific operation mode and function of each step in detail.
[0016] (1) Add solvent single product: first add the solvent used in the mixed glue to the batching equipment (such as a large batching tank or a sporadic bucket).
[0017] (2) Add fillers: During the process of continuous stirring (continuous stirring is to prevent the fillers from settling due to the influence of their own gravity during the addition process and causing pipeline blockage), add the fillers required for the glue. Mixing equipment, and continue to stir for 30 minutes, so that the solvent can fully wet the filler, and the surface of the filler particles is covered with an organic solvent to facilitate fusion with the epoxy resin.
[0018] (3) Add other items such as epoxy resin and curing agent (except accelerator): Add the epoxy resin and curing agent required to prepare the glue into the batching equipment during continuous stirring, and conti...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention relates to a burdening procedure for preparing a mixed glue solution for a copper foil-coated substrate. The burdening procedure comprises an operating procedure for controlling the adding sequence of single substances such as epoxy resin, a curing agent, a solvent, a filler and an accelerant during burdening, and mainly comprises a filler pretreatment procedure and an epoxy resin adding procedure, wherein the filler pretreatment procedure comprises the following steps of: adding solvent single substances for preparing the mixed glue solution firstly; continuously stirring and adding filler single substances; after the filler single substances are added, continually stirring for 30 minutes; and completely wetting the filler by using the solvent; and the resin adding procedure comprises the following steps of: adding an epoxy resin single substance needed in a stirring process; stirring for 120 minutes, and adding the accelerant; continually stirring for 360-420 minutes, and sampling to test the reactivity of the glue solution; and putting the qualified glue solution into use. The glue solution prepared according to the burdening procedure has higher stability, and the filler is dispersed more uniformly.
Description
technical field [0001] The invention relates to a compounding process of glue used in printed circuit boards, in particular to a compounding operation process of a mixed glue with a filler ratio of 10-50% in the glue. Background technique [0002] The batching equipment is the basic equipment for preparing the glue used in the production of printed circuit boards (copper-clad substrates). Using the batching equipment, the single products required for the preparation of the glue (single products include epoxy resin, curing agent, solvent, filler, accelerator, etc.) agent, etc.) to prepare a mixed glue solution, the stability of the mixed glue solution directly affects the basic performance of the printed circuit board produced. Therefore, it is particularly important to use batching equipment to add each single product in a certain order (also known as the operating system in the industry). For the batching system that controls the order of adding single products, the tradit...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/10
Inventor 李海明陈俊彦童立志周孝栋周飞
Owner 无锡宏仁电子材料科技有限公司