Translation-type chip flip device
A translational, chip-based technology, which is applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of insufficient speed and precision of chip flip-chip devices, large footprint of chip flip-chip devices, and high cost of use, so as to improve speed, Effects of reduced footprint, increased speed and accuracy
Inactive Publication Date: 2012-09-05
MU2 PAK WUXI SEMICON EQUIP
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Problems solved by technology
[0003] The purpose of the present invention is to provide a translational chip flip-chip device, which solves the problem of insufficient speed and precision of the existing chip flip-chip device; also solves the problems of large footprint and high cost of use of the chip flip-chip device
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[0016] For specific implementation see figure 1 , 2 , 3. The structure of the present invention includes a pickup mechanism 1 and a chip placement mechanism 2, the chip blue film 4 hangs upside down on the pickup mechanism 1 and the chip placement mechanism 2 in a downward manner, and the packaging substrate 5 and the packaging substrate workbench 3 are located Below the pick-up mechanism 1 and the release mechanism 2; the pick-up lift motor stator 6 is fixed on the pick-up mechanism base 10, the pick-up lift motor mover 7 is fixed on the pick-up lift motor connector 11, and the pick-up lifts and slides vertically Block 9 is fixed on the pick-up lifting motor connector 11, and the pick-up vertical guide rail 8 that cooperates with the pick-up vertical slide block 9 is fixed on the pick-up mechanism base 10, and the pick-up vertical slide block 9 and the pick-up vertical The guide rail 8 provides guidance and support for the lifting movement of the interconnected pick-up lift...
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The invention discloses a translation-type chip flip device comprising a chip picking mechanism and a chip releasing mechanism, wherein the chip picking mechanism is driven to go up and down in the vertical direction by virtue of one linear motor; the chip releasing mechanism is driven to go up and down in the vertical direction and to move in the longitudinal direction in a plane by virtue of two linear motors respectively; a blue chip film is hung upside down on the chip picking and releasing mechanisms, and chips of the blue chip film are downward; an package substrate is positioned below the chip picking and releasing mechanisms; the chip picking mechanism is upward to pick the chips with downward bumps on the blue chip film; and the chip releasing mechanism is downward to pick the chips from the chip picking mechanism and then is downward to adhere the chips on the package substrate in a manner of respectively aligning the bumps of the chips to a pad of the package substrate. The translation-type chip flip device can be used for picking, turning and placing the high-speed chips by virtue of small-stroke translational motion, thus improving the speed and precision of chip flip operation, and reducing the floor space to lower the using cost. The translation-type chip flip device is applicable to an LED (light-emitting diode) and integrated-circuit flip chip bonding machine and other electromechanical devices with the need of high-speed precious flip operation.
Description
technical field [0001] The invention relates to a translational chip flip-chip device, which realizes high-speed pick-up, flipping and placement of chips only through a small-stroke translational movement, and is suitable for LED and integrated circuit chip flip-chip bonding machines and other high-speed precision flip-chip bonding machines. Install the electromechanical equipment required for operation. Background technique [0002] The chip flip-chip bonding machine is a key production equipment for semiconductor devices that picks up the bare chip, flips it upside down, and then connects the bumps on the bare chip to the pads on the package substrate. Due to its unique advantages such as short electrical connection path, large number of pins and large heat dissipation area, the chip flip-chip bonding process has been more and more used in the packaging of high-frequency, multi-pin, and high-power integrated circuits. In the high-brightness, high-power LED package with sa...
Claims
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IPC IPC(8): H01L33/00H01L21/683
Inventor 何田姜凯韩笑
Owner MU2 PAK WUXI SEMICON EQUIP