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Solder mask green ink plugging method

A technology for plugging holes and inks, which is applied to the formation of electrical connection of printing elements, can solve the problems of oil on the printing surface, affect welding and appearance, and collect oil, and achieve the effect of simple anti-welding operation, good effect and cost reduction.

Active Publication Date: 2012-10-10
AOSHIKANG TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] (1) How to solve the oil leakage and oil collection on the printing surface after the plug hole, which will affect the welding and appearance

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Trial production is carried out for a plate with a plate thickness of 2.0mm and a hole diameter of 0.35mm. The specific steps are as follows

[0026] (1) Oxidize and roughen the surface of the copper plate using existing conventional operations;

[0027] (2) Make aluminum sheet plug holes on the pretreated copper plate, the thickness of the aluminum sheet for the plug holes is 0.15mm, the solder resist ink used for the plug holes does not contain diluent, the viscosity of the plug hole ink is 230PS, and the plug hole ink contains The range of curing agent and main agent ratio is 3:7.

[0028] The thickness of the scraper used in the plug hole is 2cm, and it is ground into an oblique attack angle of 85 degrees at an R angle. The scraper angle is 35°, and the scraper pressure is 5kg / cm. 2 , Scraper speed selection 2m / min.

[0029] (3) After printing the plug hole of the aluminum sheet, let it stand for 20 minutes; but the plug hole must be made of an aluminum sheet ...

Embodiment 2

[0043] Trial production is carried out for a plate with a thickness of 1.5mm and a hole diameter of 0.8mm. The specific steps are as follows

[0044] (1) Oxidize and roughen the surface of the copper plate using existing conventional operations;

[0045] (2) Plug holes with aluminum sheet on the pretreated copper plate, the thickness of the aluminum sheet for the plug hole is 0.15mm, the solder resist ink used for the plug hole does not contain thinner, the viscosity of the plug hole ink is 250PS, and the plug hole ink contains The range of curing agent and main agent ratio is 25:75.

[0046] The thickness of the scraper used in the plug hole is 2cm, and it is ground into an oblique attack angle of 85 degrees at an R angle. The scraper angle is selected to be 30°, and the scraper pressure is selected to be 5kg / cm 2 , Scraper speed selection 3m / min.

[0047] (3) After printing the plug hole of the aluminum sheet, let it stand for 30 minutes; but the plug hole must be made o...

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Abstract

The invention discloses a solder mask green ink plugging method and relates to the technical field of solder mask green ink plugging methods. According to the plugging method, an aluminum sheet is used, standing is performed after plugging and before procuring to remove air bubbles in a plughole, and during low-temperature baking, the temperature is gradually raised from 60 DEG C to 110 DEG C. By the method, the manufacturing cost can be reduced by over 10 percent, the printing ink can cover a line and a base material uniformly, the appearance meets the standard requirement of IPC-600G, no oil is spilled out of the plughole, cracking of the plughole is avoided, and plugging capability can be improved to 0.80mm.

Description

technical field [0001] The invention relates to a method for making plug holes with solder-proof green oil, in particular to a method for plug holes with solder-proof green oil used in industry, military affairs and life support. Background technique [0002] In the general production of circuit boards, after the production of the outer layer circuit is completed, the outer layer circuit must be protected against soldering to prevent the outer layer circuit from being oxidized or soldered short circuited. A short circuit is caused by the gushing out of the via hole. At the beginning, the porosity of the BGA plug is required to reach 100%. , no yellow eye circles, no cracks and obvious voids after the ink in the hole is baked at high temperature (160-288 degrees), to avoid ion pollution and electromigration caused by flux residue in the via hole during PCB processing and SMT processing, And in some harsh conditions, sulfur dioxide in the air, acidic substances, high tempera...

Claims

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Application Information

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IPC IPC(8): H05K3/40
Inventor 文国堂
Owner AOSHIKANG TECH CO LTD
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