Control technological method for planeness of surface of LTCC substrate
A technology of substrate surface and process method, applied in the direction of multilayer circuit manufacturing, etc., can solve the problem of unevenness in the welding area, achieve the effect of improving surface flatness and low cost
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[0022] A process method for controlling the surface flatness of an LTCC substrate, the specific steps of which are:
[0023] The first step is to punch green tiles
[0024] Prepare the green tiles required for the preparation of the LTCC substrate, and use a punching machine to punch the circuit through holes.
[0025] Step 2 Uncover the Mylar film
[0026] Turn the green ceramic sheet that needs to be imprinted onto the tray with clean Mylar film, press the ruler on a corner of the Mylar film in a direction parallel to the diagonal of the Mylar film, lift the corner, and follow the straight The ruler moves diagonally in parallel, and the Mylar film is lifted with the ruler, and the raw porcelain is not deformed. During the transfer process of the green tiles, a 100μm thick plastic sheet is used to support and carry to prevent deformation.
[0027] The third step through hole filling slurry
[0028] A screen printer is used to fill the LTCC process hole metal paste on the green tiles. ...
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