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Flux composition for lead-free solder and lead-free solder paste

A lead-free solder and composition technology, applied in welding/cutting media/materials, welding media, welding equipment, etc., to achieve the effects of excellent storage stability, inhibition of viscosity increase, and excellent wettability

Inactive Publication Date: 2012-10-10
ARAKAWA CHEM IND LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In this case, however, the use of this activator creates another problem: during storage and during manufacturing processes other than soldering, such as in printing, etc., a reaction between the solder particles and the activator component in the flux proceeds
However, this proposed solder still leaves room for improvement in satisfying both storage stability and wettability suitable for reflow in an atmospheric atmosphere.

Method used

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  • Flux composition for lead-free solder and lead-free solder paste
  • Flux composition for lead-free solder and lead-free solder paste
  • Flux composition for lead-free solder and lead-free solder paste

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] A flux composition was prepared so that it had the composition shown in Example 1 of Table 1. Specifically, a flux composition for lead-free solder was prepared by mixing 2 wt% of 2-butene-1,4-diol (manufactured by Tokyo Chemical Industry Co., Ltd.), 1.6 wt% of bromine active trans-2,3-dibromo-1,4-butenediol (manufactured by Tokyo Chemical Industry Co., Ltd.), 44% by weight of acrylic-modified rosin as a base resin (manufactured by Arakawa Chemical Industry Co., Ltd.) , 0.5% by weight of pentaerythritol tetrakis [3-(3,5-di-tert-butyl-4-hydroxyphenyl) acrylate] (Irganox 1010, manufactured by Ciba Japan Co., Ltd.) as an antioxidant, 34.9% by weight as a solvent Hexyldiethylene glycol (manufactured by Nippon Emulsifier Co., Ltd.), 3% by weight of sebacic acid (manufactured by Tokyo Chemical Industry Co., Ltd.) as active agent, 6% by weight of hydrogenated dimer acid (PRIPOL 1010, manufactured by Richema Co., Ltd.), 8% by weight of 12-hydroxystearic acid ethylene diamide (...

Embodiment 2

[0064] Except changing the amount of trans-2,3-dibromo-1,4-butenediol (manufactured by Tokyo Chemical Industry Co., Ltd.) A lead-free solder paste was obtained in the same manner as in Example 1 except that the amount of modified rosin (manufactured by Arakawa Chemical Industry Co., Ltd.) was changed to 44.8% by weight. Table 3 shows the evaluation results of wettability and storage stability and the bromine content.

Embodiment 3

[0066] Except changing the amount of 2-butene-1,4-diol (manufactured by Tokyo Chemical Industry Co., Ltd.) to 8% by weight, and changing the amount of hexyldiglycol (manufactured by Nippon Emulsifier Co., Ltd.) as a solvent Except that it was changed to 28.9% by weight, lead-free solder paste was obtained in the same manner as in Example 1. Table 3 shows the evaluation results of wettability and storage stability and the bromine content.

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Abstract

A flux composition for a lead-free solder, which has a bromine or chlorine content of 500 to 30000 ppm relative to the total amount of the flux composition and contains a carbon-carbon double bond compound having a specific structure in an amount of 1 to 10 wt% relative to the total amount of the flux composition, wherein the carbon-carbon double bond compound is preferably at least one compound selected from the group consisting of 2-buten-1,4-diol, 2-hepten-1-ol and 5-hexen-1-ol.

Description

technical field [0001] The present invention relates to a flux composition for lead-free solder and a lead-free solder paste. Background technique [0002] Flux is a material used to solder electronic components such as ICs, capacitors, and resistors to printed substrates, etc. Fluxes typically consist of ingredients such as base resins, activators, and solvents. For surface mounting of electronic parts, what is called a cream solder composition (solder paste), which is a paste (paste) obtained by kneading a flux composition and solder powder, is often used. Because of its printability and adhesiveness, solder paste is suitable for automated soldering and its use has increased in recent years. [0003] Solder paste is applied to the printed substrate by screen printing or with a dispenser, and electronic components are mounted thereon. The substrate is then subjected to reflow heating, thereby fixing the electronic components on the mounting substrate. The term "reflow" ...

Claims

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Application Information

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IPC IPC(8): B23K35/363
CPCB23K35/362B23K35/3618
Inventor 岩村荣治久保夏希长坂进介
Owner ARAKAWA CHEM IND LTD