Unlock instant, AI-driven research and patent intelligence for your innovation.

LED packaging structure

A technology for light-emitting diodes and packaging structures, applied in electrical components, electrical solid-state devices, circuits, etc., can solve problems such as poor reliability of lens unit separation, increase contact area and depth of mating, and shorten process time. Increase the overall product reliability, enhance the interface adhesion, and increase the effect of the contact area

Inactive Publication Date: 2012-10-17
SILICONWARE PRECISION IND CO LTD
View PDF7 Cites 9 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, compared with the aforementioned prior art, its main advantage is that it does not need to make grooves to greatly reduce production costs, and the process time is also greatly shortened; however, its disadvantage is that the bonding between the lens unit and the LED mounting seat is not so good. Tightness, resulting in poor reliability problems such as separation of the lens unit from the surface of the silicon wafer
[0008] like image 3 As shown, later generations have improved on the shortcomings of the aforementioned light emitting diode packaging structure, which utilizes dry etching (dry etching) or wet etching (wet etching) technology to make an annular groove around the outer edge of the light emitting diode chip fixing place, and Increase the contact area and embedding depth, so that the lens unit can be tightly bonded to the surface of the silicon wafer, so as to solve the above-mentioned problems of the LED packaging structure, but because this manufacturing method requires a long-term etching process, the production cost is also relatively high.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • LED packaging structure
  • LED packaging structure
  • LED packaging structure

Examples

Experimental program
Comparison scheme
Effect test

no. 1 example

[0059] see Figure 4A and Figure 4B , which is a cross-sectional view of the first embodiment of the LED packaging structure of the present invention, wherein, Figure 4B for Figure 4A Another embodiment of .

[0060] Such as Figure 4A As shown, the light emitting diode package structure of the present invention includes: a substrate 20 having opposite first surface 20a and second surface 20b, the first surface 20a defines a crystal placement region 201, and the periphery of the crystal placement region 201 is formed with concavo-convex The fitting part 2011 on the surface; the heat conduction contact 212 and a plurality of electrical contacts 211 are arranged on the crystal placement area 201; at least one light emitting diode chip 22 has an opposite active surface 22a and a non-active surface 22b, the working surface A plurality of electrode pads 221 are provided on the moving surface 22a, and a thermal conduction pad 222 is provided on the non-active surface 22b, and...

no. 2 example

[0065] see Figure 5A and Figure 5B , which is a cross-sectional view of the second embodiment of the light emitting diode packaging structure of the present invention, wherein, Figure 5B for Figure 5A Another embodiment of .

[0066] Such as Figure 5A As shown, the light-emitting diode package structure of the present invention includes: a substrate 20 having a first surface 20a and a second surface 20b opposite to each other, the first surface 20a defines a crystal placement region 201, and the periphery of the crystal placement region 201 is formed with a concave-convex surface The fitting portion 2011; the first electrical contact 211a and the second electrical contact 211b are arranged on the die placement area 201; at least one light emitting diode chip 22 has an opposite actuating surface 22a and a non-actuating surface 22b, The actuating surface 22a is provided with a first electrode pad 221a, and the non-actuating surface 22b is provided with a second electrod...

no. 3 example

[0069] see Figure 6A and Figure 6B , which is a cross-sectional view of the third embodiment of the light emitting diode packaging structure of the present invention, wherein, Figure 6B for Figure 6A Another embodiment of .

[0070] Such as Figure 6A As shown, the light-emitting diode package structure of the present invention includes: a substrate 20 having a first surface 20a and a second surface 20b opposite to each other, the first surface 20a defines a die placement region 201, and a die placement region 201 is formed around the periphery of the die placement region 201. The embedding portion 2011 of the concave-convex surface; a plurality of electrical contacts 211 are arranged on the crystal placement area 201; at least one light-emitting diode chip 22 has an opposite actuating surface 22a and a non-actuating surface 22b, the actuating surface 22a A plurality of electrode pads 221 are arranged on it, and the light-emitting diode chip 22 is connected to the elec...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to an LED packaging structure, comprising a substrate, a heat conduction contact, multiple electrical contacts, an LED chip, multiple bonding wires and a transparent material, wherein the substrate is provided with a first surface and a second surface which are relative to each other; the first surface is provided with a wafer holding area; an embedding part is formed surrounding the peripheral edge of the wafer holding area; the heat conduction contact and the multiple electrical contacts are arranged on the wafer holding area; the LED chip is connected with the heat conduction contact, and is electrically connected with the electrical contacts through the bonding wires; and the transparent material is covered on the LED chip, the embedding part, the electrical contacts, the wafer holding area, and the bonding wires. The LED packaging structure can increase the adhesive force between the wafer holding area and the transparent material so as to improve the reliablity of the packaging structure.

Description

technical field [0001] The invention relates to a packaging structure, in particular to a light emitting diode packaging structure. Background technique [0002] In recent years, light emitting diodes (light emitting diodes, referred to as LEDs) have excellent properties such as long service life, low power consumption, no warm-up time, and fast response time, so the application products of light emitting diodes are increasing day by day. With the successful development of light-emitting diodes of various colors, the era of lighting applications of light-emitting diodes has opened. As the energy-saving and carbon-saving trend continues to rise, the lighting market of light-emitting diodes is gradually expanding, gradually replacing traditional light sources such as cold-cathode tubes, halogen lamps or incandescent bulbs. [0003] In the production of light-emitting diode lighting application products, in addition to the necessary light-emitting diode chip technology, it mus...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01L33/48H01L33/54
CPCH01L2224/16225H01L2224/48091H01L2224/73265H01L2924/181H01L2924/00014H01L2924/00012
Inventor 王日富王云汉李明修李文豪陈贤文
Owner SILICONWARE PRECISION IND CO LTD