Substrate holder, substrate transfer apparatus, and substrate processing apparatus

Abstract

The invention provides a substrate holder, a substrate transfer apparatus, and a substrate processing apparatus. Disclosed is the substrate holder, which can stably hold a substrate in a correct attitude, without being affected by the rear surface state and warping of the substrate, even if the position of the substrate on the placing surface of a transfer body is shifted a little. In the substrate holder (50), at the time of holding the peripheral portion of the semiconductor wafer (W), some of the lawn grass-like protruding sections (54) on a pad main body (52) are hidden under the semiconductor wafer (W), and the rest of the protruding sections are exposed outside of the semiconductor wafer (W). Then, the protruding sections (54) hidden under the semiconductor wafer (W) sink the semiconductor wafer (W) to an appropriate depth with a gravity force by being in contact with the rear surface (WB) of the semiconductor wafer (W), and hold the semiconductor wafer (W) mainly in the longitudinal direction. Furthermore, some of the protruding sections (54) exposed near the peripheral portion of the semiconductor wafer (W) hold the semiconductor wafer (W) mainly in the horizontal direction by being in contact with the side surface (WS) of the semiconductor wafer (W).

Description

technical field [0001] The present invention relates to a substrate holder for holding a substrate to be processed on a transfer arm, a sheet-type substrate transfer device and a substrate processing device using the substrate holder. Background technique [0002] Nowadays, in the production line of semiconductor devices and FPD (Flat Panel Display, flat panel display), there is a single-sheet processing method that processes substrates (semiconductor wafers, glass substrates, etc.) one by one. process. In particular, recently, in order to achieve continuity, connection, or compounding of processes, multiple sheet-type serial (inline) processing systems in which a plurality of processing units are arranged along the conveying path of the conveying system or around the conveying path are increasing. . [0003] In such a conveyance system for a single-sheet processing unit or a multiple-sheet-type tandem processing system, a sheet-fed transport system that holds substrates i...

AI Technical Summary

Problems solved by technology

The back rubbing method is also sometimes applicable, but when the contact type holding pad is made of ceramics, the substrate tends to slide and it is difficult to hold the substrate stably

[0018] In the vacuum suction method, although there is no problem in terms of the substrate holding force, the structure of the transfer arm or the equipment of the substrate transfer device is complicated and expensive, which has become a major disadvantage in practical use, and it also operates under reduced pressure. Restrictions on the use of vacuum conveying devices that cannot work

In addition, there is a problem that particles are easy to adhere to

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