Wafer cleaning brush and wafer cleaning device

A cleaning device and cleaning brush technology, which is applied in the directions of cleaning methods and utensils, cleaning flexible items, chemical instruments and methods, etc., can solve the problems such as the inability to remove particles in a timely and effective manner and the influence of particle removal efficiency, so as to ensure the effect and good cleaning effect. , the effect of improving efficiency

Inactive Publication Date: 2012-10-31
SEMICON MFG INT (SHANGHAI) CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the existing wafer cleaning device does not have a special cleaning nozzle for the brush bucket, the particles on the brush bucket 121 cannot be effectively

Method used

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  • Wafer cleaning brush and wafer cleaning device
  • Wafer cleaning brush and wafer cleaning device
  • Wafer cleaning brush and wafer cleaning device

Examples

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Embodiment Construction

[0033] The wafer cleaning brush and wafer cleaning device of the present invention will be further described in detail below.

[0034] The invention will now be described in more detail with reference to the accompanying drawings, in which preferred embodiments of the invention are shown, it being understood that those skilled in the art may modify the invention described herein and still achieve the advantageous effects of the invention. Therefore, the following description should be understood as the broad knowledge of those skilled in the art, but not as a limitation of the present invention.

[0035] In the interest of clarity, not all features of an actual implementation are described. In the following description, well-known functions and constructions are not described in detail since they would obscure the invention with unnecessary detail. It should be appreciated that in the development of any actual embodiment, numerous implementation details must be worked out to ...

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Abstract

The invention discloses a wafer cleaning brush, which comprises a brush bucket, wherein spiral-grain brush bristles are arranged at the outer circumferential surface of the brush bucket. The invention further discloses a wafer cleaning device, which comprises a wafer cleaning brush, wherein the wafer cleaning brush is pressed at the surface of a wafer and used for brushing the wafer in a rolling way; the wafer cleaning brush comprises the brush bucket; and the spiral-grain brush bristles are arranged at the outer circumferential surface of the brush bucket. According to the invention, as the brush bristles on the brush bucket are arranged in the form of spiral grains, the journey required for small particles to leave away from the wafer can be reduced, so that the particle cleaning efficiency is increased and a purpose of rapidly and completely cleaning the particles at the surface of the wafer is achieved. In addition, as second water spraying pipes with a plurality of brush bucket cleaning nozzles are additionally arranged in one row, the particles on the brush bucket can be flushed in time, so that the particles are prevented from being brought back to the surface of the wafer again; and furthermore, the wafer cleaning effect is guaranteed, and the wafer cleaning efficiency is effectively increased. Through additionally arranged movable separately-controlled nozzles, the flushing effect of a key area can be enhanced.

Description

technical field [0001] The invention relates to the semiconductor field, in particular to a wafer cleaning brush and a wafer cleaning device. Background technique [0002] In a wafer fab, front-end-of-line (FEOL) cleaning is mainly implemented for the performance of the gate oxide layer. The cleaning of the back end of the process (BEOL) emphasizes the cleaning of contamination related to thin film, contact hole making and most recently CMP. As CMP is used in a variety of applications such as interlayer dielectric (ILD), tungsten plug fabrication, and dual damascene fabrication, back-end cleaning processes have become more stringent. [0003] Among them, the focus of post-CMP cleaning is to remove all contaminants brought about in the polishing process. These contaminants include abrasive particles, any particles carried over from the material being polished, and chemical contamination from the abrasive. These particles are either mechanically embedded in the wafer surfac...

Claims

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Application Information

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IPC IPC(8): B08B13/00B08B11/00H01L21/00
Inventor 沙酉鹤
Owner SEMICON MFG INT (SHANGHAI) CORP
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