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High-cutting-force diamond micro powder and preparation method thereof

A technology of diamond micropowder and high cutting force, applied in diamond and other directions, can solve the problems of large cutting edge of a single particle, small number of cutting edges, fragmentation of cleavage surface, etc., to achieve less scratches on the surface of the workpiece, long service life, raw materials sufficient effect

Active Publication Date: 2012-10-31
HENAN UNION ABRASIVES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The traditional diamond micropowder has a single crystal structure, the surface of the particle is relatively smooth, the number of cutting edges is small, and the cutting force is weak; the cutting edge of a single particle is large and hard, and the scratch is serious; at the same time, it is broken along the cleavage plane when it is impacted by an external force, and the particle size is very fast. Smaller, shorter grinding life
In the IT industry, hard disks and magnetic heads require very high surface finish and flatness; in optical communications, the roughness Ra value of the end face of the optical fiber connector is at the nanometer level, and the grinding and polishing of sapphire wafers in the LED industry not only requires strong cutting force, Moreover, it is required to have no scratches on the surface of the wafer, which cannot be achieved by traditional single crystal diamond powder.

Method used

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  • High-cutting-force diamond micro powder and preparation method thereof
  • High-cutting-force diamond micro powder and preparation method thereof
  • High-cutting-force diamond micro powder and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042]The product of the present invention is 3 μm high-cutting force diamond powder, and the particle surface of the product has a large number of sharp cutting edges, and its cutting force reaches about 2.3 times that of ordinary single crystal diamond powder; its specific surface area is 1.415m 2 / g, compared with the specific surface area of ​​ordinary single crystal diamond powder (1.259 m 2 / g), the specific surface area increased by 12.39%.

[0043] The preparation method of the product 3 μm high cutting force diamond micropowder of the present invention:

[0044] Weigh 500 g of single crystal diamond powder with an average particle size of 3.4 microns and put it into a porcelain crucible, put it into a vacuum furnace together with the porcelain crucible, and slowly evacuate until the vacuum degree reaches 10 -2 Pa; then heated to 650°C, and filled with a mixed gas of nitrogen and oxygen at the same time, the volume ratio of nitrogen and oxygen in the mixed gas was con...

Embodiment 2

[0049] The product of the present invention is 6 μm high-cutting force diamond powder. The particle surface of the product has a large number of sharp cutting edges, and its cutting force is about 3.3 times that of ordinary single crystal diamond powder; its specific surface area is 0.654m 2 / g.

[0050] Compared with the specific surface area of ​​ordinary 6μm single crystal diamond powder (0.448m 2 / g), the specific surface area increased by 45.98%.

[0051] The preparation method of the product 6 μm high cutting force diamond micropowder of the present invention:

[0052] Weigh 500 g of single crystal diamond powder with an average particle size of 6.5 microns and put it into a porcelain crucible, put it into a vacuum furnace together with the porcelain crucible, and slowly evacuate until the vacuum degree reaches 10 -2 Pa; then heated to 700°C, and filled with a mixed gas of nitrogen and oxygen at the same time, the volume ratio of nitrogen and oxygen in the mixed gas wa...

Embodiment 3

[0057] The product of the present invention is 9 μm high cutting force diamond powder, the particle surface of the product has a large number of sharp cutting edges, and its cutting force is about 2.8 times that of ordinary single crystal diamond powder; its specific surface area is 0.416m 2 / g.

[0058] Compared with the specific surface area of ​​ordinary 9μm single crystal diamond powder (0.352m 2 / g), the specific surface area increased by 18.18%.

[0059] The preparation method of the product 9 μm high cutting force diamond micropowder of the present invention:

[0060] Weigh 500 g of single crystal diamond powder with an average particle size of 9.4 microns and put it into a porcelain crucible, put it into a vacuum furnace together with the porcelain crucible, and slowly evacuate until the vacuum degree reaches 10 -2 Pa; then heated to 700°C, and filled with a mixed gas of nitrogen and oxygen at the same time, the volume ratio of nitrogen and oxygen in the mixed gas wa...

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Abstract

The invention discloses high-cutting-force diamond micro powder and a preparation method thereof. A large amount of sharp cutting edges are arranged on the surfaces of grains of high-cutting-force diamond micro powder; the cutting force is 2 to 4 times of that of a common monocrystal diamond micro powder; and the specific surface area of the diamond micro powder with the particle size average of 3 microns, 6 microns, 9 microns, 15 microns or 30 microns is much larger than that of common monocrystal diamond micro powder with the particle size average of 3 microns, 6 microns, 9 microns, 15 microns or 30 microns. The high-cutting-force diamond micro powder is strong in cutting force and long in service life, the scratches on the surface of a ground and polished workpiece are less, the requirements of the modern industry on the high grinding and polishing efficiency and high grinding and polishing precision are met, and the development of a precise grinding and polishing technology can bepromoted. The high-cutting-force diamond micro powder is mainly suitable for precisely grinding and polishing in the IT (information technology) industry, the optical communication industry, the LED industry, the aerospace industry, the automobile industry and the other industries.

Description

technical field [0001] The invention relates to a diamond micropowder, in particular to a high cutting force diamond micropowder and a preparation method thereof. Background technique [0002] Diamond micropowder has high hardness, high wear resistance and good corrosion resistance. These excellent properties make it a favorite in the field of grinding and polishing since its birth. [0003] Natural diamond, commonly known as diamond, has been one of the most expensive gemstones for centuries, symbolizing nobility, beauty, holiness and eternity. However, the brilliant colors of beautiful diamonds cannot be separated from grinding and polishing. In the early days, people tried to use other materials to polish diamonds, but because diamonds are hard and corrosion-resistant, they can be said to be invulnerable. At this time, diamond powder came into being. [0004] After entering the industrial age, diamond powder has not only been used in diamond polishing, but has been wid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C01B31/06
CPCC01B31/06C01B32/25
Inventor 高礼明付存王森汪静
Owner HENAN UNION ABRASIVES
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