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Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof

An ultraviolet laser cutting chip technology, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of low cutting efficiency, low yield, edge curling of the cutting road, etc., to improve cutting efficiency and improve finished products The effect of yield

Active Publication Date: 2012-11-14
JIANGYIN DELI LASER EQUIP
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The current cutting method mainly uses knife cutting, which has low cutting efficiency and inherent defects. During the cutting process, there is curling phenomenon on the edge of the cutting road, and the yield rate is low.

Method used

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  • Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof

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Embodiment Construction

[0026] see figure 1 , the present invention relates to a galvanometer-type ultraviolet laser cutting wafer chip device, the device includes a laser 1, the laser light generated by the laser 1 enters the vibration after passing through the shutter 2, the beam expander 3 and the reflector 4 in sequence Mirror system 5, the laser beam emitted by the galvanometer system 5 is focused on the chip 9 to be cut placed on the platform 10, the two sides above the platform 10 are respectively provided with a blowing system 7 and a dust collection system 8, the platform 10 A CCD alignment observation system 6 is also provided above, and the laser 1 and the galvanometer system 5 are connected to the control system 12 through the communication system 11; wherein the laser 1 is an ultraviolet high-frequency pulse laser, which emits high-frequency pulses with a wavelength in the ultraviolet range For laser light, the reflective mirror 4 is an ultraviolet reflective mirror whose function is to ...

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Abstract

The invention relates to a vibrating mirror type ultraviolet laser cutting wafer chip device which comprises a laser (1), wherein the laser generated by the laser (1) enters a vibrating mirror system (5) sequentially through an optical gate (2) and a bean expanding mirror (3); the laser emitted by the vibrating mirror system (5) is focused on a chip (9) to be cut, and the chip (9) is arranged on a platform (10); a scavenger system (7) and a dust collecting system (8) are respectively arranged at the two sides above the platform (10); a charge coupled device (CCD) alignment observation system (6) is also arranged above the platform (10); two reflection lenses (4) are respectively arranged on a light path between the bean expanding mirror (3) and the vibrating mirror system (5); and the angles of 45 degrees are respectively formed by the reflection surfaces of the two reflection lenses (4) and the light path. The vibrating mirror type ultraviolet laser cutting wafer chip device is high in cutting efficiency and cutting yield.

Description

technical field [0001] The invention relates to a device and method for cutting and separating wafer chips, in particular to a device and method for cutting stainless steel substrate wafer chips by using an ultraviolet laser. Background technique [0002] At present, with the continuous development of silicon wafer chip technology, due to cost factors, a silicon wafer chip based on stainless steel substrates has been developed; The smaller the chip size, the more chips per unit area, which puts forward new requirements for chip cutting methods and cutting efficiency. [0003] The current cutting method mainly adopts cutting tool cutting, which has low cutting efficiency and has inherent defects. During the cutting process, there is curling phenomenon on the edge of the cutting line, and the yield rate is low. Contents of the invention [0004] The object of the present invention is to overcome the above disadvantages, and provide a vibrating mirror type ultraviolet laser ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/38B23K26/14B23K26/04B23K26/42B23K26/064B23K26/16B23K26/70
Inventor 赵裕兴狄建科蔡仲云张子国益凯劼张伟闫华
Owner JIANGYIN DELI LASER EQUIP