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Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof

A technology for cutting chips and ultraviolet lasers, applied in laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of low cutting efficiency, low yield, edge curling of cutting edges, etc., so as to improve cutting efficiency and improve finished products. Yield effect

Active Publication Date: 2015-06-10
JIANGYIN DELI LASER EQUIP
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  • Application Information

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Problems solved by technology

[0003] The current cutting method mainly uses knife cutting, which has low cutting efficiency and inherent defects. During the cutting process, there is curling phenomenon on the edge of the cutting road, and the yield rate is low.

Method used

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  • Vibrating mirror type ultraviolet laser cutting wafer chip device and method thereof

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Embodiment Construction

[0026] See figure 1 , The present invention relates to a galvanometer ultraviolet laser cutting wafer chip device. The device includes a laser 1. The laser light generated by the laser 1 passes through the shutter 2, the beam expander 3, and the mirror 4 in turn and enters the vibration A mirror system 5, the laser light emitted by the galvanometer system 5 is focused on the chip to be cut 9 placed on the platform 10, and an air blowing system 7 and a dust collection system 8 are respectively provided on both sides of the platform 10, the platform 10 A CCD alignment observation system 6 is also provided above. The laser 1 and the galvanometer system 5 are connected to the control system 12 via the communication system 11; the laser 1 is an ultraviolet high-frequency pulse laser, which emits high-frequency pulses with a wavelength in the ultraviolet range. For laser, the reflecting mirror 4 is an ultraviolet reflecting mirror, and its function is to reflect the laser in the ultr...

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PUM

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Abstract

The invention relates to a vibrating mirror type ultraviolet laser cutting wafer chip device which comprises a laser (1), wherein the laser generated by the laser (1) enters a vibrating mirror system (5) sequentially through an optical gate (2) and a bean expanding mirror (3); the laser emitted by the vibrating mirror system (5) is focused on a chip (9) to be cut, and the chip (9) is arranged on a platform (10); a scavenger system (7) and a dust collecting system (8) are respectively arranged at the two sides above the platform (10); a charge coupled device (CCD) alignment observation system (6) is also arranged above the platform (10); two reflection lenses (4) are respectively arranged on a light path between the bean expanding mirror (3) and the vibrating mirror system (5); and the angles of 45 degrees are respectively formed by the reflection surfaces of the two reflection lenses (4) and the light path. The vibrating mirror type ultraviolet laser cutting wafer chip device is high in cutting efficiency and cutting yield.

Description

Technical field [0001] The invention relates to a device and a method for cutting and separating wafer chips, in particular to a device and a method for cutting stainless steel base wafer chips by using ultraviolet laser. Background technique [0002] At present, with the continuous development of silicon wafer technology, due to cost factors, a silicon wafer based on a stainless steel substrate has been developed; in addition, as the function integration of the chip becomes higher and higher, the size of the single chip is increasing. The smaller the chip, the more and more chips per unit area, and new requirements for chip cutting methods and cutting efficiency. [0003] The current cutting method mainly adopts knife cutting, which has low cutting efficiency and inherent defects. During the cutting process, there is a curling phenomenon at the edge of the cutting path, and the yield is low. Summary of the invention [0004] The purpose of the present invention is to overcome the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/38B23K26/14B23K26/04B23K26/402B23K26/70B23K26/064B23K26/16
Inventor 赵裕兴狄建科蔡仲云张子国益凯劼张伟闫华
Owner JIANGYIN DELI LASER EQUIP