Miniature microwave component for surface-mounting
A microwave component and surface mount technology, applied in waveguide devices, semiconductor/solid-state device components, connection devices, etc.
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[0076] Figure 3a and 3b Components according to the invention shown include: a microwave chip (MMIC) 100, for example for figure 1 A chip of a prior art packaged embodiment having an active face 102 including active components and a chip back 104; and a main feature of the components according to the invention, a passive multilayer integrated circuit 120, formed for An electromagnetic coupling element that couples the part to the external environment.
[0077] The passive multilayer integrated circuit 120 and the chip 100 are encapsulated in a plastic package 122 which includes a contactless microwave port 124 realized by electromagnetic coupling for operation at an operating frequency F0.
[0078] Figure 3a The component includes a metal base 134 with an inner face 135 and an outer face 137 for mounting the component on a printed circuit. The metal base 134 includes an opening 138 for forming the contactless microwave port 124 of the microwave component.
[0079] The p...
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