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Miniature microwave component for surface-mounting

A microwave component and surface mount technology, applied in waveguide devices, semiconductor/solid-state device components, connection devices, etc.

Active Publication Date: 2015-05-20
联合单片电路半导体股份公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

These solutions are limited for two substantial reasons: implementation cost (equipment, learning, reproducibility), part production cost

Method used

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  • Miniature microwave component for surface-mounting
  • Miniature microwave component for surface-mounting
  • Miniature microwave component for surface-mounting

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0076] Figure 3a and 3b Components according to the invention shown include: a microwave chip (MMIC) 100, for example for figure 1 A chip of a prior art packaged embodiment having an active face 102 including active components and a chip back 104; and a main feature of the components according to the invention, a passive multilayer integrated circuit 120, formed for An electromagnetic coupling element that couples the part to the external environment.

[0077] The passive multilayer integrated circuit 120 and the chip 100 are encapsulated in a plastic package 122 which includes a contactless microwave port 124 realized by electromagnetic coupling for operation at an operating frequency F0.

[0078] Figure 3a The component includes a metal base 134 with an inner face 135 and an outer face 137 for mounting the component on a printed circuit. The metal base 134 includes an opening 138 for forming the contactless microwave port 124 of the microwave component.

[0079] The p...

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PUM

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Abstract

A miniature component includes an MMIC microwave chip encapsulated in an individual package for surface-mounting capable of operating at a frequency F0 very much higher than 45 GHz; and at least one contactless microwave port, by electromagnetic coupling, ensuring the transmission of coupling signals at a working frequency F0. The component comprises a passive multilayer integrated circuit having metallized layers and layers of dielectric material, a top face, a metallized bottom face, the metallized bottom face comprising, on the side of the contactless microwave port, an opening in the metallization for the passage of the coupling electromagnetic waves via the contactless microwave port and, between two layers of dielectric material, a metallized layer having at least one electromagnetic coupling electrical conductor connected to the electronic elements of the chip, said coupling electrical conductor being situated at the level of the contactless microwave port to ensure the transmission of microwave signals by electromagnetic coupling at the working frequency F0.

Description

technical field [0001] The invention relates to electronic components operating at millimeter frequencies and having contactless electromagnetic ports. Background technique [0002] These types of electronic components include at least one chip (or integrated circuit) operating at millimeter frequencies and are used in particular in the field of automotive radar. In these types of applications, electromagnetic waves are transmitted at millimeter frequencies, and waves reflected by obstacles are received by antennas to extract from the waves distance information and relative velocity information between this obstacle and the source of the emitted waves. To this end, the vehicle is equipped with a system comprising radars positioned all around the vehicle, enabling it to detect objects. A long-range radar operating at eg 77 GHz is positioned in front of the vehicle and a short-range radar operating at 24 GHz and 79 GHz is positioned behind and to the sides of the vehicle. ...

Claims

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Application Information

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IPC IPC(8): H01P5/02H01P5/107H01L23/00H05K1/18
CPCH01L23/047H01L2924/1423H01P5/028H01P5/107H05K1/0243H05K2201/037H05K2201/09072H05K2201/10727H01L2224/16225H01L2224/32245H01L2224/48091H01L2224/48137H01L2224/48247H01L2224/49171H01L2224/73265H01L2224/04042H01L2924/00014H01L2924/00011H01L2924/00H01L2224/0401
Inventor P-F·阿洛姆C·图桑
Owner 联合单片电路半导体股份公司