Solder resist for high-temperature co-fired multilayer ceramic and preparation method of solder resist

Abstract

The invention relates to a solder resist for high-temperature co-fired multilayer ceramic. The solder resist for the high-temperature co-fired multilayer ceramic consists of organic powder and organic carriers. The organic powder consists of main body solder resisting materials and firing aids. The main body solder resisting materials consist of one or more of aluminum oxide, magnesium oxide and zirconium oxide. The firing aids consist of a plurality of compounds which at least contain one element of calcium, magnesium, aluminum and silicon and are mixed according to certain proportions. The organic carriers consist of mixed solvent, binder, dispersing agent, thixotropic agent and coloring agent, wherein the mixed solvent is made of ethanol and terpineol according to certain proportions; and the binder is made of at least one of polyvinyl butyral, polypropylene carbonate and ethyl cellulose. The invention additionally discloses a preparation method of the solder resist. The solder resist disclosed by the invention has the advantages that the cost of raw materials is low, the preparation process is simple, a multilayer ceramic processing technology and a high-temperature co-firing technology are compatible with each other, the solder resisting effect is good, the strength of bonding between a solder resisting coating layer and a ceramic substrate is high, the thermal expansion matching performance is good and the salt mist is resisted.

Description

technical field [0001] The invention relates to a solder resist, in particular to a solder resist applied to high-temperature co-fired multilayer ceramics. The invention also discloses its preparation method. Background technique [0002] High-temperature co-fired multilayer ceramics is an important technology in the field of electronic packaging. By printing metallized patterns on ceramic substrates with a multi-layer structure and metallized via holes through the ceramics to form electrical connections, co-fired at high temperatures, high reliable ceramic package. Based on the design of electrical properties, it is necessary to perform solder masking on certain areas of high-temperature co-fired multilayer ceramics to prevent the growth of the plating layer and control the flow of solder. The commonly used solder resist material for the main body of solder resist is an organic material, which can only be used on cooked porcelain after high-temperature co-firing, which ha...

AI Technical Summary

Problems solved by technology

The commonly used solder resist main body solder resist material is an organic material, which can only be used on cooked porcelain after high temperature co-firing, which has great limitations in technology

And the field of application of high-reliability ceramic packaging has high requirements for the bonding force and corrosion resistance of the solder mask layer, and the commonly used organic solder mask is difficult to meet