Method for growing self-stripping GaN thin film on sapphire substrate
A sapphire substrate, gallium nitride technology, applied in the semiconductor field, can solve the problems of complex device process and high density
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[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.
[0027] Aiming at the problem that the most commonly used laser lift-off technology peels off the sapphire substrate and the GaN epitaxial wafer at the position of the buffer layer, the laser wavelength and pulse time must be precisely controlled, which increases the difficulty of the process and increases the production cost. The invention provides In the a-side gallium nitride self-stripping method, during the cooling process after the growth, the weak bonding layer will break, and the high-quality gallium nitride epitaxial film is peeled off from the sapphire substrate and separated from the sapphire substrate. The weak bonding layer plays a role in releasing stress and improving crystal quality during the growth process...
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