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A method for growing self-exfoliating gallium nitride thin films on sapphire substrates

A sapphire substrate, gallium nitride technology, applied in the semiconductor field, can solve the problems of complex device process and high density

Inactive Publication Date: 2015-09-09
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] In order to overcome the shortcomings of the existing high defect density of gallium nitride on the non-polar surface and the complex process of subsequent manufacturing of gallium nitride on sapphire, the present invention provides a method using an InGaN insertion layer and a low-temperature GaN buffer layer as a weak bonding layer. A method for growing a self-exfoliating a-plane gallium nitride thin film on a sapphire substrate, which can obtain a GaN single crystal thin film with good quality

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  • A method for growing self-exfoliating gallium nitride thin films on sapphire substrates
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[0026] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be described in further detail below in conjunction with specific embodiments and with reference to the accompanying drawings.

[0027] Aiming at the problem that the most commonly used laser lift-off technology peels off the sapphire substrate and the GaN epitaxial wafer at the position of the buffer layer, the laser wavelength and pulse time must be precisely controlled, which increases the difficulty of the process and increases the production cost. The invention provides In the a-side gallium nitride self-stripping method, during the cooling process after the growth, the weak bonding layer will break, and the high-quality gallium nitride epitaxial film is peeled off from the sapphire substrate and separated from the sapphire substrate. The weak bonding layer plays a role in releasing stress and improving crystal quality during the growth process...

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Abstract

The invention discloses a method for growing a self-stripping GaN thin film on a sapphire substrate, which utilizes metal organic chemical vapor deposition (MOCVD) equipment to grow the self-stripping a-face GaN thin film on the sapphire substrate by serving a InGaN insertion layer and a low-temperature GaN buffer layer as weak bonding layers and comprises the following steps of: taking the sapphire substrate; leading ammonia gas into the MOCVD equipment, nitriding the sapphire substrate, and growing a nitriding layer on the sapphire substrate; leading an indium source, a gallium source and the ammonia gas into the MOCVD equipment by using carrier gas to obtain a InGaN layer on the nitriding layer; leading the gallium source and the ammonia gas into the MOCVD equipment by using the carrier gas, and growing the low-temperature GaN buffer layer; and leading the gallium source and the ammonia gas into the MOCVD equipment by using the carrier gas, and growing a GaN epitaxial layer. According to the method, the InGaN insertion layer and the low-temperature GaN buffer layer serve as the weak bonding layers, the self-stripping GaN thin film having high crystallization quality can be obtained.

Description

technical field [0001] The invention belongs to the field of semiconductor technology, in particular to a method for growing a self-stripping a-plane GaN thin film on an r-plane sapphire substrate using an InGaN insertion layer and a low-temperature GaN buffer layer as a weak bonding layer using MOCVD equipment. Background technique [0002] Gallium nitride, as a representative of the third-generation wide-bandgap semiconductor materials, can be used to make optoelectronic devices such as light-emitting diodes, laser diodes, and high electron mobility transistors. Since group III nitrides have a hexagonal wurtzite structure, they have large spontaneous polarization and piezoelectric polarization, and there is a large polarization electric field along the c-axis, which will seriously affect the recombination efficiency of light-emitting devices, and the light-emitting wavelength is also Unstable, so there is an urgent need for growth of materials with non-polar surfaces. How...

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C30B25/02C30B25/18C30B29/38
Inventor 王建霞李志伟赵桂娟桑玲刘长波魏鸿源焦春美杨少延刘祥林朱勤生王占国
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI