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Method for treatment of a board and a board element

A board element and board technology, applied in the field of wood material board elements, can solve problems such as poor water resistance HDF, etc., achieve good wear resistance, and reduce the consumption of varnish and/or paint.

Inactive Publication Date: 2013-01-02
MB ADELTRA
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the use of these binders in a continuous process produces HDF with relatively poor water resistance

Method used

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  • Method for treatment of a board and a board element
  • Method for treatment of a board and a board element
  • Method for treatment of a board and a board element

Examples

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[0086] According to an example, 200 g of a composition containing 40% binder and 60% water was added to a HDF board. This binder is phenol formaldehyde and the phenol formaldehyde concentration corresponds to 80 g of phenol formaldehyde. This HDF board has 970kg / m 3 The original density and the size of the main face of this HDF board is 1m 2 . The thickness of this HDF board is 4mm. A composition containing 80 g of phenol formaldehyde was applied to the main face of the HDF board and pressed into the HDF board by applying a mechanical pressure of 30 MPa for 3 minutes in the manner described above. After this treatment, HDF boards get 1050kg / m 3 Density.

[0087] The following examples show how much the swelling of HDF boards is reduced due to the improved water resistance after treatment according to the method of the invention. A conventional HDF board with a thickness of 4 mm was placed in a water bath for 24 hours, where the water was kept at a temperature of 20°C. A...

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Abstract

The invention relates to a method for treating a board (1) of wood material, such as an HDF board, an MDF board, a plywood board, planks or boarding, comprising the steps of providing a board (1) of wood material, arranging a composition (8) comprising a binder (9) on a first main face (2) of said board (1), arranging said board (1) on a draining surface (22), heat- treating said board (1) and the composition (8) arranged thereon, and pressing the composition (8) into said board (1). The invention also relates to a board element comprising one or more board layers, which board element comprises binder, the binder being heterogeneously distributed in at least one of said one or more board layers.

Description

technical field [0001] The present invention relates to a method for treating boards of woody material such as HDF boards, MDF boards, plywood, planks or planks. The invention also relates to a panel element of wood material comprising one or more plies. Background technique [0002] Wood-based or wood fiber-based products have a wide variety of applications and can be used in joinery, in furniture production, in building works, etc. Timber may be used in the form of material that has been machined into boards or planks merely by sawing or planing. Veneers, ie 0.5-2 mm thick wood panels, can be glued together in layers to form a plywood, such as veneer plywood. Wood fiber can be obtained from low quality logs for the manufacture of wood fiber based products such as various types of fibreboards such as MDF boards and HDF boards (Medium Density Fibreboard and High Density Fibreboard). HDF board can be defined as having a weight higher than 800kg / m 3 Density fiberboard, whi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B27N7/00B27K3/12B27K5/06
CPCC08L61/06B05D3/0254B27K2240/70B27K3/0242B05D3/12C08L97/02B27N7/00B27K3/15B27K2200/10Y10T428/24066Y10T428/31957Y10T428/31982Y10T428/31946B27K3/12B27K5/065
Inventor 米连科·比斯克
Owner MB ADELTRA
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