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Photohardening resin composition and application thereof

A technology of resin composition and photohardening, applied in the field of photohardenable resin composition, can solve the problems of small volume shrinkage, poor hardening rate, defectiveness, etc., and achieve the effect of improving reliability

Active Publication Date: 2013-01-09
DAXIN MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The volume shrinkage rate of the resin composition is small, but the hardening rate is easy to be poor due to the process conditions, and the acrylate monomers are not fully reacted, resulting in poor quality such as outgassing and other easy to occur in subsequent use.

Method used

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  • Photohardening resin composition and application thereof
  • Photohardening resin composition and application thereof
  • Photohardening resin composition and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] Preparation of light-curing resin composition

[0060] The photocurable resin composition of Example 1 contains (A) 100 parts by weight of the oligomer UC203 containing an ethylenic bond, and (B) a monomer containing at least one acrylate group including dicyclopentadienyl ethoxyacrylate 22.2 Parts by weight and 12.3 parts by weight of methyltriethylene glycol acrylate, (C) photoinitiator includes 3.4 parts by weight of TPO and 6.8 parts by weight of I184, and (D) 196.6 parts by weight of softener polybutadiene. After the above-mentioned components are uniformly mixed, the photocurable resin composition is prepared.

[0061] Hardened programming

[0062] The photocurable resin composition was irradiated with a low-pressure mercury lamp contained in an exposure machine (purchased from USHIO, model USH-500BYI), where the ultraviolet band was 365nm and the exposure intensity was 30mW / cm 2 And the radiation dose is 5000mJ / cm 2 , Curing the resin composition.

[0063] Curing ratio ...

Embodiment 2~4 and comparative example 1~2

[0075] The preparation methods of the photocurable resin compositions of Examples 2 to 4 and Comparative Examples 1 to 2 are the same as those of Example 1, except that the examples and comparative examples select different compounds containing at least one acrylate group monomer Types, the chemicals used in Examples 2 to 4 and Comparative Examples 1 to 2 and their amounts are described in Table 1.

[0076] The photocurable resin compositions of Examples 2 to 4 and Comparative Examples 1 to 2 were analyzed for curing rate. The analysis and calculation methods are the same as those of Example 1. The calculation results are shown in Table 1.

[0077] Table 1

[0078]

[0079] As shown in Table 1, the compositional difference between Examples 1 to 4 and Comparative Examples 1 to 2 mainly lies in the types of monomers containing at least one acrylate group. From the test results, it can be clearly known that Examples 1 to 4 can obtain a curing rate higher than 90% and a forward bonding ...

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Abstract

A photohardening resin composition comprises (A) oligomer containing ethylenic bonds, (B) monomers containing at least one acrylate group, and (C) a photoinitiator, wherein (B) is selected from mono-acrylate monomers shown in formula (I), bis-acrylate monomers shown in formula (II) or a composition of the two, and the formula (I) and the formula (II) are defined in the specification and the claims. The invention also provides an adhesion layer formed by irradiation of the photohardening resin composition, a display element containing the adhesion layer, and a method for preparing the display element by using the photohardening resin composition. The hardening of the photohardening resin composition of the invention causes no gas release phenomenon, which further improves the reliability of the display element for subsequent application.

Description

Technical field [0001] The present invention relates to a resin composition, in particular to a photocurable resin composition. Background technique [0002] Optical clear resin is mainly used for bonding optical components [such as touch panels, liquid crystal display panels, cover lenses, lenticular lenses, TFT-LCD modules, etc.]; After the glue is hardened, it can be used as a spacer between the components. Therefore, in addition to the adhesiveness, the optical glue needs to meet the properties (such as mechanical properties, optical properties, etc.) requirements of subsequent products. [0003] Optical glues can be roughly classified into thermosetting resin compositions, light curing resin compositions, and photothermosetting resin compositions. Since some display elements such as electroluminescence (EL) devices have a heat resistance temperature of about 80~120°C, they have poor heat resistance and are not suitable for heating. Therefore, thermosetting resin compositions ...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J7/00C09J5/00
Inventor 李信宏吴督宜谢育材
Owner DAXIN MATERIALS
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