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Light-emitting diode encapsulating structure and manufacturing method thereof

A technology for light-emitting diodes and packaging structures, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve the problems of wire falling off, the complicated and tedious process of bonding and bonding, and affecting the production yield of light-emitting diode packaging structures, so as to facilitate heat dissipation. , the effect of the production process is simple

Inactive Publication Date: 2013-01-09
ZHANJING TECH SHENZHEN +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the die-bonding process is not only complicated and cumbersome, but also prone to wire fall-off due to human error, which affects the production yield of the LED packaging structure

Method used

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  • Light-emitting diode encapsulating structure and manufacturing method thereof
  • Light-emitting diode encapsulating structure and manufacturing method thereof
  • Light-emitting diode encapsulating structure and manufacturing method thereof

Examples

Experimental program
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Embodiment Construction

[0021] See figure 1 , the light emitting diode packaging structure 100 provided by the first embodiment of the present invention includes a substrate 10, an electrode 20, a light emitting diode 30 fixed on the electrode 20 and electrically connected to the electrode 20, a package body 40 covering the light emitting diode 30 and a reflector Section 50.

[0022] The substrate 10 is roughly in the shape of a rectangular plate, and the substrate 10 includes an upper surface 11 , a lower surface 12 opposite to the upper surface 11 , and several side surfaces 13 connecting the upper surface 11 and the lower surface 12 . At least two through holes 14 are opened on the substrate 10 . In this embodiment, there are two through holes 14 , the through holes 14 are respectively close to the opposite side surfaces 13 of the substrate 10 , and each through hole 14 extends from the upper surface 11 to the lower surface 12 . The through hole 14 is used for accommodating the electrode 20 . B...

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PUM

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Abstract

The invention discloses a light-emitting diode encapsulating structure, which comprises an electrode, a plurality of light-emitting diodes and an encapsulating body, wherein the light-emitting diodes are electrically connected with the electrode; the encapsulating body is covered on the light-emitting diodes; the electrode comprises a plurality of metal layers which are formed at certain intervals; one surface of the encapsulating body which is adjacent to the electrode is provided with grooves which correspond to the light-emitting diodes; the light-emitting diodes are accommodated in the grooves, and are connected with the electrode through electrode pads; and reflecting parts are arranged around the peripheral part of the encapsulating body which is close to the electrode. The invention further relates to a manufacturing method of the light-emitting diode encapsulating structure.

Description

technical field [0001] The invention relates to a semiconductor structure, in particular to a light emitting diode packaging structure and a manufacturing method thereof. Background technique [0002] Compared with traditional light sources, Light Emitting Diodes (LEDs) have the advantages of light weight, small size, low pollution, and long life. As a new type of light source, they have been more and more widely used. [0003] Existing LED packaging structures generally include a substrate, electrodes formed on the substrate, and LED chips mounted on the substrate and electrically connected to the electrodes. The connection between the light emitting diode chip and the electrode is usually completed by die bonding. However, the die-bonding and bonding process is not only complicated and cumbersome, but also easily leads to falling off due to human error, thereby affecting the production yield of the light-emitting diode packaging structure. Moreover, the heat dissipation ...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/62H01L33/64H01L33/60H01L33/00
CPCH01L2224/16225H01L2224/16245
Inventor 胡必强许时渊
Owner ZHANJING TECH SHENZHEN
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