Light-emitting diode encapsulating structure and manufacturing method thereof
A technology for light-emitting diodes and packaging structures, which is applied to electrical components, electrical solid-state devices, circuits, etc., can solve the problems of wire falling off, the complicated and tedious process of bonding and bonding, and affecting the production yield of light-emitting diode packaging structures, so as to facilitate heat dissipation. , the effect of the production process is simple
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[0021] See figure 1 The light emitting diode package structure 100 provided by the first embodiment of the present invention includes a substrate 10, an electrode 20, a light emitting diode 30 fixed on the electrode 20 and electrically connected to the electrode 20, a package body 40 covering the light emitting diode 30, and a reflector 部50.
[0022] The substrate 10 is approximately in the shape of a rectangular flat plate. The substrate 10 includes an upper surface 11, a lower surface 12 opposite to the upper surface 11, and a plurality of side surfaces 13 connecting the upper surface 11 and the lower surface 12. At least two through holes 14 are opened on the substrate 10. In this embodiment, there are two through holes 14, the through holes 14 are respectively close to two opposite side surfaces 13 of the substrate 10, and each through hole 14 extends through from the upper surface 11 to the lower surface 12. The through hole 14 is used to accommodate the electrode 20. The u...
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