Annular super-hard abrasive wire and method for manufacturing same

A superabrasive and ring-shaped technology, which is applied in the manufacture of tools, sawing machine tool manufacturing, metal sawing equipment, etc., can solve the problems of wide kerf, poor cutting surface quality, low efficiency, etc., to achieve smooth cutting surface, cutting Low cost, uniform effect
CN102873401BActive Publication Date: 2014-11-12CHINA NONFERROUS METAL (GUILIN) GEOLOGY & MINING CO LTD
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Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
CHINA NONFERROUS METAL (GUILIN) GEOLOGY & MINING CO LTD
Publication Date
2014-11-12

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Abstract

The invention discloses an annular super-hard abrasive wire and a method for manufacturing the same. The annular super-hard abrasive wire comprises a rope, super-hard abrasive particles and a coating, wherein the size of the rope ranges from 0.1mm to 6mm, the super-hard abrasive particles are solidified on the surface of the rope, and the coating is used for solidifying the super-hard abrasive particles. The method for manufacturing the annular super-hard abrasive wire includes braiding the thin rope to form a ring with an optional perimeter; and then solidifying the super-hard abrasive particles on the surface of the annular rope by means of coating to form the high-strength annular super-hard abrasive wire with the uniform outer diameter and a long service life. The annular super-hard abrasive wire is low in cost, high in fatigue strength, long in service life, good in cutting quality and high in cutting efficiency, and a cutting machine with the annular wire can be used for cutting conductors, semiconductors and non-conductor materials.
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Description

(1) Technical field:

[0001] The invention relates to cutting tools for precious metals, semiconductors and non-conductors, in particular to an annular superhard abrasive wire and a manufacturing method thereof. (two) background technology:

[0002] Brittle and hard materials such as silicon, sapphire, and ceramics have high hardness and high brittleness, and are prone to chipping and damage during the cutting process, causing damage to the material and reducing the yield. Therefore, these materials are difficult to cut by ordinary processing methods. Traditional semiconductor materials and ceramic materials are usually cut by diamond inner circle and outer circle cutting technology, diamond band saw. With the development of the semiconductor industry, the diameter of monocrystalline silicon ingots is getting larger and larger, reaching 450 mm, and polycrystalline silicon ingots are also 800 mm. At present, band saws are mainly used for cutting, truncating and squaring. The ...

Claims

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