Epoxy molding compound for packaging tantalum capacitor and manufacturing method for epoxy molding compound
A technology of epoxy plastic encapsulant and tantalum capacitor, which is applied in the direction of capacitor shell/package, capacitor parts, etc., can solve the problems of long curing time, leaking seal, broken ribs, etc., to achieve high production efficiency, improve reliability, reduce internal effect of stress
Active Publication Date: 2013-01-30
天津凯华绝缘材料股份有限公司
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Problems solved by technology
However, under such process conditions, ordinary epoxy molding compounds have many disadvantages. For example, when
Method used
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Embodiment 1
[0037] Epoxy molding compound for tantalum capacitor packaging, weigh each component according to the ratio in Table 1, mix evenly, melt and knead the mixed material in a twin-screw extruder at 100 degrees, crush the tablet after cooling, and use a cake maker Pre-compression molding, testing product performance indicators.
Embodiment 2
[0039] Weigh each component according to the ratio in Table 1, mix evenly, melt and knead the mixed material in a twin-screw extruder at 120 degrees, press the tablet and cool it, then pulverize it, pre-press it with a cake maker, and test the product performance indicators.
Embodiment 3
[0041] Weigh each component according to the ratio in Table 1, mix evenly, melt and knead the mixed material in a twin-screw extruder at 150 degrees, press the tablet and cool it, crush it, pre-press it with a cake maker, and test the product performance indicators.
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Abstract
The invention relates to an epoxy molding compound for packaging a tantalum capacitor and a manufacturing method for the epoxy molding compound, and belongs to the technical field of epoxy molding compounds. The epoxy molding compound for packaging the tantalum capacitor is characterized by comprising the following components in percentage by mass: 3 to 10 percent of multifunctional epoxy resin, 1 to 5 percent of multifunctional phenolic resin, 0.5 to 3 percent of reactive diluent, 0.5 to 2 percent of stress-releasing agent, 0.1 to 1 percent of accelerant and 70 to 90 percent of mineral filler. The manufacturing method comprises the following steps of: adding the components of the epoxy molding compound into a mixer, mixing the components uniformly, extruding the mixture by using a twin-screw extruder at the temperature of between 100 and 150 DEG C, cooling, crushing and performing pre-press molding to obtain the epoxy molding compound for packaging the tantalum capacitor. The epoxy molding compound for packaging the tantalum capacitor is halogen-free and antimony-free, can package tantalum capacitors at low temperature and under low pressure, and is low in stress, and high in moldability, relux resistance, wet resistance and reliability; the manufacturing method is convenient to operate, high in production efficiency, safe and reliable, and product quality is stable; and the epoxy molding compound is particularly suitable for packaging a polymer solid chip tantalum capacitor.
Description
technical field [0001] The invention belongs to the technical field of epoxy molding compounds, in particular to an epoxy molding compound for tantalum capacitor packaging and a preparation method thereof. Background technique [0002] At present, epoxy molding compound is mainly composed of epoxy resin, cross-linking curing agent, curing accelerator and additives. Because of its many outstanding characteristics, such as good thermal stability, insulation, adhesion, good mechanical properties, excellent molding process performance and low cost, it is widely used in the packaging of tantalum capacitors. Compared with aluminum electrolytic capacitors, tantalum capacitors are characterized by long life, high temperature resistance, high accuracy, and excellent performance in filtering high-frequency harmonics, and are gradually replacing traditional ordinary tantalum capacitors. Different from ordinary tantalum capacitors, the cathode layer of polymer tantalum capacitors is a ...
Claims
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Login to view more IPC IPC(8): C08L63/00C08L61/06C08G59/32C08G59/62C08K7/18H01G9/08
Inventor 罗春晖任志军
Owner 天津凯华绝缘材料股份有限公司
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