Low-temperature curing powder coating for coating medium-density fiber board and preparation method for coating
A powder coating and fiberboard technology, applied in powder coatings, conductive coatings, polyester coatings, etc., can solve the problems of difficulty in popularization and application, cumbersomeness, etc., and achieve the effects of shortening coating time, high powdering efficiency, and improving spraying efficiency
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Example Embodiment
[0028] Example 1
[0029]
[0030] Preparation:
[0031] (a) Weigh each component according to the proportion, place it in the mixing tank, mix well and crush for 1-20 minutes;
[0032] (b) The crushed material is extruded into the twin or single screw extruder; the heating temperature of the extruder is controlled at 70~90℃;
[0033] (c) The extruded material is compressed into a powder with a particle size (equivalent particle size D50) of 50 microns by tableting, cooling, and a pulverizer, and then sieved and packaged.
Example Embodiment
[0034] Example 2
[0035]
[0036]
[0037] Preparation:
[0038] (a) Weigh each component according to the proportion, place it in the mixing tank, mix well and crush for 5 minutes;
[0039] (b) The crushed material is extruded in a twin or single screw extruder; the heating temperature of the extruder is controlled at 80℃;
[0040] (c) The extruded material is compressed into a powder with a particle size (equivalent particle size D50) of 50 microns by tableting, cooling, and a pulverizer, and then sieved and packaged.
Example Embodiment
[0041] Example 3
[0042]
[0043] Preparation:
[0044] (a) Weigh each component according to the proportion, place it in the mixing tank, mix well and crush for 5 minutes;
[0045] (b) The crushed material is extruded in a twin or single screw extruder; the heating temperature of the extruder is controlled at 80℃;
[0046] (c) The extruded material is compressed into a powder with a particle size (equivalent particle size D50) of 50 microns by tableting, cooling, and a pulverizer, and then sieved and packaged.
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap