Crystal curing press head of radio frequency identification back-off packaging device

Abstract

The invention relates to a crystal curing press head of a radio frequency identification back-off packaging device. An air cylinder barrel of the press head is connected with an upper hot-press head template through a connecting assembly. A spring is installed in an adjusting ring, the adjusting ring and the spring are sleeved on a piston rod of an air cylinder, and the upper end of the adjusting ring is in threaded connection with the air cylinder barrel. The press head is connected with the lower portion of the piston rod through a heat insulating and dissipating device. The air cylinder is a gap sealing air cylinder. The crystal curing press head of the radio frequency identification back-off packaging device adopts the gap sealing air cylinder to replace a low-friction air cylinder, and the gap sealing air cylinder is simple in structure, good in low-friction performance and sealing performance, small in guiding gap and capable of avoiding shake of the piston rod in the moving process, so that the hot-press precision is high. Due to the fact that the gap sealing air cylinder is not provided with a sealing part made of a heat-intolerant material, the heat insulation is not strict, and a structure of the heat insulating and dissipating device is simplified.

Description

technical field [0001] The invention relates to an electronic label upside-down packaging device, in particular to an electronic label upside-down packaging device capable of realizing good thermal bonding of a chip and an antenna. Background technique [0002] The die-bonding head is applied to the electronic label equipment, and heats and presses the chip in the previous bonding process to effectively fix the chip and realize electrical conduction. [0003] After reviewing relevant information and inspecting a variety of electronic label upside-down packaging machine equipment, we learned that tiny cracks may occur in chips during multiple processes such as wafer slicing and bonding. The failure of the chip is mainly caused by chip cracks. If the thermal pressure is too high, the chip is prone to cracks, and if the thermal pressure is too small, the hot-press die bonding effect cannot be achieved. Therefore, the adjustment of the thermal pressure and the control and adjust...

AI Technical Summary

Problems solved by technology

The low-friction cylinder used is an outsourced part with good low-friction performance, but its guide gap is relatively large, which has a certain impact on the accuracy of hot pressing

In addition, its sealing structure adopts a rubber diaphragm seal, which has poor heat resistance, so the heat insulation requirements for the pressure head are relatively high, resulting in a complicated heat insulation structure for the pressure head, resulting in irregular shape and structure of the pressure head.

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