Toughening epoxy resin composition

A technology of tough epoxy resin and halogen epoxy resin, applied in the field of toughened epoxy resin composition for copper clad laminates, can solve the problems of difficulty in taking into account the heat resistance and performance degradation of epoxy resin, and achieve convenient large-scale industrialization The effect of production, low dielectric constant, excellent mechanical properties

Inactive Publication Date: 2013-02-20
彭代信
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The methods of toughening epoxy resin used above will bring about the decline of other properties to a certain extent, it is difficult to take into account the heat resistance of epoxy resin, and cannot meet the current high-density development requirements of the electronics industry at the same time

Method used

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  • Toughening epoxy resin composition
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Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with specific embodiments.

[0025] The formula of the epoxy resin composition of embodiment 1~4 and comparative example 1~2 is shown in table 1

[0026] Epoxy resin composition formula in the embodiment of table 1

[0027]

[0028] Follow the steps below to prepare a copper clad laminate

[0029] (1) Prepare the glue solution according to the formula in Table 1: add epoxy resin, phenolic resin, polymer microspheres, flame retardant, solvent to the container, start stirring, and get the epoxy resin composition glue solution in 2 hours;

[0030] (2) Preparation of prepreg: cut flat and clean glass cloth six pieces of 50cm×50cm, evenly coat the glue solution of the above-mentioned examples 1 to 4 and comparative examples 1 to 2 on both sides of each glass cloth, the glue content is 50% , baked in an oven at 170° C. for 2 minutes to prepare a prepreg.

[0031] (3) Preparation of copper-cla...

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Abstract

The invention relates to a toughening epoxy resin composition for copper-clad plate. Except for lower dielectric constant and dielectric loss, the toughening epoxy resin composition has excellent mechanical property, high heat resistance and flame retardant property, also has a more compact structure, and can meet the demand of the copper-clad plate for a high-frequency circuit board.

Description

technical field [0001] The invention relates to an epoxy resin composition, in particular to a toughened epoxy resin composition for copper clad laminates. Background technique [0002] With the development of light, thin, small, high-density and multi-functional electronic products, the assembly density and integration of components on printed circuit boards are getting higher and higher, and the frequency of signal transmission is getting higher and higher. The circuit layer that plays the role of signal transmission The spacing is getting smaller and the line width is getting narrower and narrower, which puts forward higher requirements for the drilling and edge fishing process in the circuit board processing process. At the same time, the mechanical properties of the copper clad laminate, which is the most circuit board substrate material edge effect. [0003] Epoxy resin, as the main material in the current copper clad laminate industry, has excellent adhesion, physica...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08L61/06C08L101/00B32B15/092B32B15/20
Inventor 彭代信
Owner 彭代信
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