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Split-gate type groove power metal oxide semiconductor (MOS) device

A MOS device, split gate technology, applied in semiconductor devices, electrical components, circuits, etc.

Active Publication Date: 2013-02-20
HARBIN ENG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The problem with this device is that the device is prone to premature breakdown, and the breakdown point occurs at the nearest position between the outermost cell and the terminal protection ring

Method used

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  • Split-gate type groove power metal oxide semiconductor (MOS) device
  • Split-gate type groove power metal oxide semiconductor (MOS) device
  • Split-gate type groove power metal oxide semiconductor (MOS) device

Examples

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Embodiment Construction

[0020] The present invention proposes layout edge design of split-gate trench power MOS devices. The trench structure in the device cell is specially designed to communicate with the terminal structure, and the mesa structure in the active region is a long strip structure with equal diameters and semicircles at both ends. While not adding process steps and photolithographic plates, the process steps are saved, the breakdown voltage of the device is ensured, and the working reliability of the device is improved.

[0021] In the research of split-gate trench power MOS devices, it is found that when the trench depth is constant, the breakdown voltage of split-gate trench power MOS devices is mainly affected by the distance between the trenches in the active region of the device. The traditional split-gate MOS device has a trench structure surrounded by mesas. At the corner of the device, the distance between the terminal trench and the trench in the active area varies greatly (suc...

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PUM

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Abstract

The invention relates to the field of layout edge design of metal oxide semiconductor (MOS) devices and particularly relates to a split-gate type groove power MOS device communicated with a terminal structure and applied to groove structures in low and medium voltage devices. A groove structure in an active area is communicated with the terminal structure, the table face of the active area is of a long strip structure with two ends semicircular, and the diameter of the semicircle is identical with the width of the table face. The split-gate type groove power MOS device is of a structure that the groove encloses the table face structure, so that the table face of the active area of the device is ensured to be consistent, electric field distribution in the table face structure in the device is optimized, and breakdown voltage of the split-gate type groove power MOS device is improved integrally accordingly.

Description

technical field [0001] The invention relates to the field of layout edge design of MOS devices, in particular to a split gate type trench power MOS device used in low and medium voltage devices in which the trench structure communicates with the terminal structure. Background technique [0002] In the 1990s, the main research direction of the development of Power Trench MOSFET and industrialization technology was mainly to minimize the forward conduction resistance (Ron) of low-voltage power devices. Today, the structure of power trench MOS devices is suitable for most power MOSFET applications, and the characteristics of the devices are constantly approaching the one-dimensional limit of silicon materials (expressing the characteristic on-resistance in the drift region of the device and the breakdown in the off-state Theoretical relationship of voltage). The proposal of REduced SURface Field (RESURF) technology can make power trench MOS devices with a breakdown voltage of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L29/78H01L29/06
Inventor 王颖胡海帆焦文利
Owner HARBIN ENG UNIV
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