High temperature resisting pressure-sensitive adhesive composition and high temperature resisting pressure-sensitive adhesive tape

A technology of pressure-sensitive tape and composition, which is applied in the field of high-temperature-resistant pressure-sensitive adhesive composition and high-temperature-resistant pressure-sensitive tape, can solve the problems of EVA being non-reactive and unable to withstand high temperatures, and achieve the goal of reducing transportation and storage costs Effect

Active Publication Date: 2013-03-06
明尼苏达矿业制造特殊材料(上海)有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, because EVA is not reactive, EVA acts like a plasticizer after curing, so it cannot withstand high temperatures

Method used

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  • High temperature resisting pressure-sensitive adhesive composition and high temperature resisting pressure-sensitive adhesive tape
  • High temperature resisting pressure-sensitive adhesive composition and high temperature resisting pressure-sensitive adhesive tape
  • High temperature resisting pressure-sensitive adhesive composition and high temperature resisting pressure-sensitive adhesive tape

Examples

Experimental program
Comparison scheme
Effect test

Embodiment A

[0079] Example A. Synthesis of reactive polyacrylates

[0080] Weigh all the raw materials shown in Table 2 into a 500ml three-neck flask, stir with a pneumatic stirrer (ZD-J-1 type, Shanghai Zuoda Coating Equipment Co., Ltd.) under N2 purging, and heat up to 60°C After 24 hours of reaction, a light yellow clear viscous liquid (40% solid content) was obtained after cooling. This viscous liquid could be directly used in subsequent experiments without any treatment. The glass transition temperature (Tg) in the table is calculated by FOX equation.

[0081] Table 2.

[0082]

Embodiment B

[0083] Example B. Preparation of Pressure Sensitive Adhesive Composition and Pressure Sensitive Tape

[0084] A pressure-sensitive adhesive composition and a pressure-sensitive adhesive tape were prepared using the samples numbered A-H prepared in Example A, respectively.

Embodiment 1

[0091] Add the above-mentioned various components into a 500ml flask after weighing, and stir for 30 minutes with a pneumatic stirrer (ZD-J-1 type, Shanghai Zuoda Coating Equipment Co., Ltd.) to obtain a reactive polymer with a reactive functional group. Acrylate / epoxy hybrid solution. After standing for 20 minutes to eliminate air bubbles, use a comma roll applicator to coat the reactive polyacrylate / epoxy resin hybrid solution on the PET release film coated with silicon release agent on both sides, and control the thickness of the coating to 50 Microns (dried glue thickness). After drying in an oven at 105° C. for 10 minutes to dry the solvent, an ultraviolet light-induced curing pressure-sensitive adhesive tape was obtained, but the initial tack of the adhesive tape was weak.

[0092] After the ultraviolet light-induced curing pressure-sensitive adhesive tape prepared according to this formula is sealed and packaged in a black plastic bag, its shelf life at room tem...

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Abstract

The invention provides a high temperature resisting pressure-sensitive adhesive composition which comprises a) 25-75wt% of reactive polyacrylate; b) 20-70wt% of epoxy resin; c) 0.3-8wt% of hydroxyl compound; and d) 0.02-5wt% of photoinitiator. The invention further provides a pressure-sensitive adhesive tape which comprises a base material; and a pressure-sensitive adhesive layer which is formed by the pressure-sensitive adhesive composition.

Description

technical field [0001] The invention relates to a high temperature-resistant pressure-sensitive adhesive composition and a high-temperature-resistant pressure-sensitive adhesive tape, in particular to a high-temperature-resistant pressure-sensitive adhesive composition and a high-temperature-resistant pressure-sensitive adhesive tape induced and cured by ultraviolet light. Background technique [0002] Current electronic products such as notebooks, automotive products, and handheld mobile terminals are trending toward miniaturization, lightness, thinning, and high production efficiency. This trend requires that more and more polymer materials (such as plastics) be used in such products , rubber, etc.), so adhesive products with high bonding strength to these materials are required to achieve firm bonding with a small bonding area. [0003] Traditionally, one- or two-component structural adhesives have sufficed for the bonding tasks of these products. However, there are many...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/04C09J163/00C09J7/02
Inventor 吴庆王能高飞刘轶博于慧彭庆瑞万红梅
Owner 明尼苏达矿业制造特殊材料(上海)有限公司
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