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Resonating element, resonator, electronic device, electronic apparatus, moving vehicle, and method of manufacturing resonating element

一种振动元件、电子装置的技术，应用在压电/电致伸缩器件的制造/组装、压电器件/电致伸缩器件、压电器件的或电致伸缩器件的零部件等方向，能够解决振动部有效面积减少等问题，达到减轻负担、快检测的效果

Active Publication Date: 2013-03-06
SEIKO EPSON CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It has been clarified that there is a problem that the effective area of ​​the vibrating part decreases due to the generation of the etching residue, so that the CI value of the main vibration is close to the ratio of the CI value of the spurious response (=CIs / CIm, where CIm is the main vibration CI value, CIs is the CI value of the parasitic response, an example of the standard is above 1.8), etc. do not meet the requirements

Method used

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  • Resonating element, resonator, electronic device, electronic apparatus, moving vehicle, and method of manufacturing resonating element
  • Resonating element, resonator, electronic device, electronic apparatus, moving vehicle, and method of manufacturing resonating element
  • Resonating element, resonator, electronic device, electronic apparatus, moving vehicle, and method of manufacturing resonating element

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Experimental program
Comparison scheme
Effect test

Embodiment approach 1

[0313] As a method of further reducing and suppressing the stress generated by the packaging of the piezoelectric vibrating element, various structures shown below can be adopted.

[0314] The piezoelectric substrate 10 in FIG. 33( a ) includes a thin portion having a vibrating portion 12 , and a thick portion 13 provided on an edge of the thin portion and having a thickness greater than that of the thin portion. A slit 20 is provided along the vibrating portion 12 in one thick portion in the thick portion 13 , and mounting portions F are connected laterally side by side with the buffer portion S interposed therebetween in the edge direction. The mounting portion F has chamfered portions 21 at both end portions in a direction perpendicular to the direction in which the mounting portion F, the buffer portion S, and the thick portion 13 are arranged.

[0315] The piezoelectric substrate 10 in FIG. 33( b ) includes a thin portion having a vibrating portion 12 , and a thick portio...

Embodiment approach 2

[0321] 35(a) to 35(c) show modified examples of the piezoelectric vibrating element 1, FIG. 35(a) is a plan view, and FIG. 35(b) shows the pad electrode 29a of the piezoelectric vibrating element 1 (mounting part F ) is an enlarged top view, and FIG. 35(c) is a cross-sectional view of the mounting part F. In this attachment part F, in order to increase the bonding strength, the surface is formed in a concave-convex shape, and the bonding area is enlarged.

[0322] Symbol Description

[0323] 1, 1', 2, 3, 4, 6, 7... Piezoelectric vibration elements

[0324] 8 electronic equipment

[0325] 10 piezoelectric substrate

[0326] 10W crystal chip

[0327] 11, 11' recessed part

[0328] 12 vibration department

[0329] 12a, 12b, 12c, 12d one side of the vibrating part

[0330] 13 thick wall part

[0331] 14 The fourth thick wall part

[0332] 14a The main body of the fourth thick-walled part

[0333] 14b fourth inclined part

[0334] 15 The third thick wall part

[0335] 1...

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Abstract

A piezoelectric resonating element includes a piezoelectric substrate having a rectangular vibrating portion and a thick-walled portion, excitation electrodes and, and lead electrodes. The thick-walled portion includes a fourth thick-walled portion, a third thick-walled portion, a first thick-walled portion, and a second thick-walled portion. The third thick-walled portion includes a third slope portion and a third thick-walled body, and at least one slit is formed in the third thick-walled portion.

Description

technical field [0001] The present invention relates to a vibrator that excites a thickness-shear vibration mode, and particularly relates to a vibrating element having a so-called inverted mesa structure, a vibrator, an electronic device, an electronic device using the vibrator, a moving body using the vibrator, and a vibrating element. Manufacturing method. Background technique [0002] As an example of a vibrator, the vibration mode of the main vibration excited by the AT-cut crystal vibrator is thickness shear vibration, which is suitable for miniaturization and high frequency, and the frequency temperature characteristic has an excellent cubic curve. Therefore, in the piezoelectric oscillator , electronic equipment and many other aspects are used. [0003] In recent years, AT-cut crystal resonators are expected to be further increased in frequency, and accordingly, the vibrating part of the vibrating piece used in the AT-cut crystal resonators needs to be further thinn...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H9/19H03H9/02H03H3/02
CPCH01L41/047H01L41/08H03H9/132H03H9/131H03H9/0542H03B5/32H03H9/19H01L41/04H03H9/0552H03H9/1021H01L41/22Y10T29/42H10N30/87H10N30/00
Inventor 石井修村上资郎
Owner SEIKO EPSON CORP
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