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A corrugated electroplated diamond wire

A technology of electroplating diamond and corrugated shape, which is applied in the direction of metal sawing equipment, metal processing equipment, sawing machine tools, etc. It can solve the problems that diamond particles are easy to fall off and affect the service life, so as to achieve enhanced chip removal ability and eliminate line marks , the effect of broad application prospects

Active Publication Date: 2015-11-25
CHANGSHA DIAT NEW MATERIAL SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The present invention aims to provide a corrugated electroplated diamond wire with long service life, good cutting surface quality, good chip removal function, which can effectively improve cutting quality, reduce or even eliminate line marks on the cutting surface, and has long service life. To solve the technical problem that the diamond particles on the existing electroplated diamond wire are easy to fall off and affect the service life

Method used

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  • A corrugated electroplated diamond wire
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  • A corrugated electroplated diamond wire

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Select the corrugated shape is U-shaped, the peak height is 0.05 ~ 0.5mm, the wave pitch is 1 ~ 5mm, the metal embryo wire is 0.1mm in diameter, the diamond particle size is 10 ~ 20μm, and the corrugated electroplating method is prepared by composite electroplating method. The diamond wire is compared with the linear diamond wire prepared by the same wire diameter, the same diamond particle size, and the same process. On the same cutting machine, slice two polysilicon rods of the same size, the diameter of the polysilicon rod is 2″, and cut out 50 silicon wafers at the same time. After cutting, observe the wear condition of the diamond wire and the line marks of the sliced ​​section, as shown in Table 1:

[0018] Table 1

[0019]

[0020] The service life of the corrugated electroplated diamond wire and the quality of the cut section are obviously better than that of the ordinary straight line electroplated diamond wire.

Embodiment 2

[0022] Choose a metal embryo wire with a V-shaped corrugation, a peak height of 1-1.5 mm, a wave pitch of 5-10 mm, and a wire diameter of 0.5 mm. The diamond particle size is 60-70 μm, and the corrugated electroplating method is prepared by composite electroplating. The diamond wire is compared with the linear diamond wire prepared by the same wire diameter, the same diamond particle size, and the same process. On the same cutting machine, slice two polysilicon rods of the same size, the diameter of the polysilicon rod is 2″, and cut out 50 silicon wafers at the same time. After cutting, observe the wear of the diamond wire and the line marks on the end face of the slice, as shown in Table 2:

[0023] Table 2

[0024]

[0025] The service life of the corrugated electroplated diamond wire and the quality of the cut section are obviously better than that of the ordinary straight line electroplated diamond wire.

Embodiment 3

[0027] Choose a metal embryo wire with a V-shaped corrugation, a peak height of 2.5-3mm, a wave pitch of 10-15mm, and a wire diameter of 1.2mm. The diamond particle size is 130-150μm, and the corrugated electroplated diamond prepared by the composite electroplating method Wire, compared with the straight diamond wire prepared by the same wire diameter, the same diamond particle size, and the same process. On the same cutting machine, slice two polysilicon rods of the same size, the diameter of the polysilicon rod is 2″, and cut out 50 silicon wafers at the same time. After cutting, observe the wear condition of the diamond wire and the line marks of the sliced ​​section, as shown in Table 3:

[0028] table 3

[0029]

[0030] The service life of the corrugated electroplated diamond wire and the quality of the cut section are obviously better than that of the ordinary straight line electroplated diamond wire.

[0031] It can be known from Tables 1, 2, and 3 that the servic...

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Abstract

An electroplated diamond wire of corrugated shape is disclosed. The diamond wire is comprised of a metal blank wire and diamond particles coated on a surface of the metal blank wire. The metal blank wire is the corrugated wire having at least one corrugation shape selected from U or V shape. The height of the crest is 0.05~3mm, and the distance between two crests is 1~15mm. The diameter of the metal blank wire is 0.1~1.2mm. The diameter of the diamond particle is 10~150µm. The diamond wire is prepared by a composite electroplating method. The electroplated diamond wire of the invention has advantages of long life, good quality of cutting surfaces, excellent cutting processing capacity, good chip removal function; and the cutting quality is effectively improved, the wire track of the cutting surface is reduced or even eliminated. The electroplated diamond wire is suitable for industrialized production and use.

Description

technical field [0001] The invention relates to an electroplated diamond wire, in particular to a corrugated electroplated diamond wire, which is a diamond wire prepared by a composite electroplating method by using a metal wire with a corrugated structure as a baseline. It belongs to the field of cutting and processing consumables for hard and brittle materials. Background technique [0002] Hard and brittle materials include various stones, gemstones, glass, silicon crystals, quartz crystals, hard alloys, ceramics, rare earth magnetic materials, etc. Hard and brittle materials are mostly non-conductors or semiconductors, usually with high hardness, high brittleness, high wear resistance, high corrosion resistance, high resistivity, high temperature resistance, and non-magnetic conductivity. Because hard and brittle materials have excellent characteristics that are incomparable to metal materials, they have a very wide range of uses. The promotion and application of hard ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23D61/18
CPCB23D61/185
Inventor 段志明匡怡新熊佳海刘纯辉
Owner CHANGSHA DIAT NEW MATERIAL SCI & TECH
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