Method for treating semiconductor technology wastewater

A semiconductor and wastewater technology, which is applied in the fields of water/sewage multi-stage treatment, water/sludge/sewage treatment, chemical instruments and methods, etc., and can solve problems such as semiconductor process wastewater treatment methods that are not mentioned

Inactive Publication Date: 2013-04-03
金光祖
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The examples of previous patents only used glucose and sodium acetate as artificial substrates for experiments, and did not mention the treatment method for semiconductor process wastewater containing oxidants, organic and ammonia nitrogen pollutants

Method used

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  • Method for treating semiconductor technology wastewater
  • Method for treating semiconductor technology wastewater
  • Method for treating semiconductor technology wastewater

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] Example 1: De-oxidizing system test

[0037] 1.H 2 o 2 Remove test data with dosing sodium sulfite

[0038] The test was carried out in continuous operation, and the concentration of the influent wastewater is shown in Table 2. The test process and operating parameters of the mold factory: dosing sodium sulfite, the dosing amount is 1.2 times the theoretical value, so that the H 2 o 2 Down to <5ppm (test time 200 hours). The description of the water quality after treatment by the deoxidizing system is shown in Table 2.

[0039] Table 2, H 2 o 2 Remove test data with dosing sodium sulfite

[0040]

[0041] From the data in Table 2, it can be seen that the oxidant removal system with dosing can be used to effectively remove H from this complex wastewater 2 o 2 oxidizing agent.

[0042] 2.H 2 o 2 Catalyst removal of test data

[0043] a. With MnO 2 test

[0044] The test was carried out in continuous operation, and the concentration of wastewater at the ...

Embodiment 2

[0063] Example 2: Process testing of oxidant removal system, biological aerobic / anaerobic system and reverse osmosis system

[0064] 1. Test data of deoxidizing system + biological aerobic system (tested with monomer)

[0065] The test was carried out in continuous operation, and the concentration of wastewater at the water inlet is shown in Table 6. The test process and operating parameters of the mold factory: firstly add sodium sulfite to make H 2 o 2 Reduce to <40ppm, and adjust the pH value to 6.8; there are monomers in the biological aerobic tank (residence time 12 hours). The water quality after biological aerobic tank treatment is shown in Table 6.

[0066] Table 6. Test data of deoxidizing system + biological aerobic system (tested with monomer)

[0067]

[0068]

[0069] 2. Deoxidant system + biological anaerobic / aerobic system (tested with biofilm) + reverse osmosis system test data

[0070] The test was carried out in continuous operation, and the concen...

Embodiment 3

[0076] Example 3: Degassing / Absorptive System Testing

[0077] The test was carried out in continuous operation, and the concentration of wastewater at the water inlet is shown in Table 8. Model factory test process and operating parameters: First, the wastewater is adjusted to a pH value of 11.5 in a pH tank, and then introduced into a degassing tank where the air is blown from the bottom at a ratio of air to water flow rate of 1000:1, degassing The wastewater residence time of the tank was 1.2 hours. NH 4 The ammonia nitrogen degassing efficiency of OH wastewater is 80%. The description of the effluent quality is shown in Table 8. The ammonia-containing air coming out of the liquid surface is sent to an absorption tank, and the ammonia gas (product ammonium phosphate) is absorbed with phosphoric acid aqueous solution.

[0078] Table 8. Degassing / Absorptive System Tests

[0079]

[0080]

[0081] The data in Table 8 shows that other species in the wastewater will n...

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Abstract

The invention provides a method for treating synthetic wastewater collected by several strands of semiconductor technology wastewater, wherein the synthetic wastewater does not contain the NH4F/HF buffered oxide etch solution wastewater (NH4F/F wastewater for short), but basically contains an oxidizing agent, organic and inorganic substances, and ammonia nitrogen impurities. Firstly, the synthetic wastewater is treated by an antioxidant; subsequently treated in the anaerobic microbial decomposition way, the impurities are partly decomposed; and then the wastewater is treated in the aerobic microbial decomposition way, the residual organic substances and the ammonia nitrogen impurities are furthermore decomposed, thus the recyclable or dischargeable wastewater is obtained. The method also comprises the steps of individually treating an NH4OH rinsing wastewater, a TMAH yellow light technology wastewater or the NH4F/F wastewater, and also comprises the treatment method of collecting the individually treated wastewaters into the synthetic wastewater.

Description

technical field [0001] The present invention relates to a treatment method for semiconductor process wastewater, and provides a treatment method for comprehensive wastewater that contains impurities such as oxidant, organic matter, inorganic matter, and ammonia nitrogen and is collected from several strands of semiconductor process wastewater, and may contain NH 4 OH leaching wastewater treatment, TMAH (tetramethylammonium hydroxide) yellow light process wastewater treatment, or NH 4 F / F - Individual treatment such as wastewater treatment. Background technique [0002] Water recycling and reuse has become a necessary solution for high water consumption industries in the current era of abnormal climate change; the dependence of factories on external water sources must be greatly reduced to reduce uncertain factors in production. A high water recovery rate solves the problem of uncertain factors in production, but it also creates another issue: the problem of excessive envir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C02F9/14
Inventor 金光祖陈秋美
Owner 金光祖
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