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Conductive paste composition for low temperature firing

A conductive paste, low temperature sintering technology, applied in conductive materials dispersed in non-conductive inorganic materials, nanotechnology for materials and surface science, metal processing equipment, etc., can solve limitations, increase metal wire packing density, etc. question

Inactive Publication Date: 2013-04-03
SAMSUNG ELECTRO MECHANICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, compositions containing flake powders and nanopowders are difficult to increase the packing density of metal wires by themselves
Even with copper-integrated powder compositions of this type, there are limitations to achieving good electrical properties when sintered at low temperatures

Method used

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  • Conductive paste composition for low temperature firing
  • Conductive paste composition for low temperature firing
  • Conductive paste composition for low temperature firing

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Experimental program
Comparison scheme
Effect test

Embodiment 1-5

[0052] A 3-roll kneader (3-roll kneader) was used to mix and disperse the components shown in Table 1 below to prepare a conductive paste, which was printed with a line width of about 100 μm by a screen printing machine for use as Silicon wafers of solar cells were then sintered at about 200 ° C for 1 h in a reducing atmosphere, and then the resistivity, contact resistance, aspect ratio and adhesion were measured. The results are shown in Table 1 below.

[0053] Table 1

[0054]

[0055] In Table 1, the acrylic resin is methyl ethylhexyl acrylate, and the plasticizer is dioctyl phthalate.

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Abstract

Disclosed is a conductive paste composition for low temperature firing, including conductive copper powder composed of flake powder, spherical powder and nano powder, a melamine-based binder, and an organic solvent, thus enabling the formation of a conductive wire having a high aspect ratio with high printability, and inexpensive formation of a metal wire, and exhibiting superior electrical properties and adhesive force even when conducting low temperature firing at 200 DEG C or less, so that the conductive paste composition can be usefully applied as a conductive material for forming electrodes of a variety of products such as solar cells, touch panels, printed circuit boards (PCBs), radio-frequency identification (RFID), plasma display panels (PDPs) and so on.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of Korean Patent Application No. 10-2011-0094964, filed Sep. 21, 2011, entitled "Conductive Paste Composition for Low Temperature Sintering", which is hereby incorporated by reference in its entirety Application. technical field [0003] The invention relates to a conductive paste composition for low-temperature sintering. Background technique [0004] Recently, the demand for low-cost and low-temperature sintering of electrodes used in printed circuit boards (PCBs), radio frequency identification (RFID), touch panels, plasma display panels (PDPs), solar cells, etc. has gradually increased, so even when performing low-temperature sintering Inexpensive conductive pastes that still possess excellent electrical properties have received much attention. [0005] Although a conductive paste mainly composed of silver is traditionally used, silver is an expensive rare metal and it is diffi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
CPCH01B1/22B82Y30/00H01J17/49B22F1/16
Inventor 李永日金东勋金俊永权志汉金成殷
Owner SAMSUNG ELECTRO MECHANICS CO LTD