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Non-outer-pin semiconductor package structure and manufacturing method and lead frame strip thereof

A manufacturing method and technology of lead frame strips are applied in the direction of semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., to achieve the effects of improving cutting efficiency, reducing costs, and avoiding friction

Active Publication Date: 2013-04-03
ASE (KUNSHAN) INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] In view of this, the present invention provides a semiconductor packaging structure without external leads, its manufacturing method and lead frame strips, so as to solve the problems caused by the high-cost pre-plating and cutting process in the prior art

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  • Non-outer-pin semiconductor package structure and manufacturing method and lead frame strip thereof
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  • Non-outer-pin semiconductor package structure and manufacturing method and lead frame strip thereof

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Embodiment Construction

[0020] The following descriptions of the various embodiments refer to the accompanying drawings to illustrate specific embodiments in which the present invention can be practiced. Furthermore, the directional terms mentioned in the present invention are, for example, up, down, top, bottom, front, back, left, right, inside, outside, side, surrounding, central, horizontal, transverse, vertical, longitudinal, axial, The radial direction, the uppermost layer or the lowermost layer, etc. are only directions referring to the attached drawings. Therefore, the directional terms used are used to illustrate and understand the present invention, but not to limit the present invention.

[0021] Please refer to figure 1 and figure 2 As shown, the lead frame bar of the semiconductor package structure without external leads according to an embodiment of the present invention is a strip-shaped plate body, which is usually made of copper, iron, aluminum, nickel or equivalent metal or alloy,...

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Abstract

The invention discloses a non-outer-pin semiconductor package structure and a manufacturing method and a lead frame strip thereof. The manufacturing method includes: providing a lead frame strip comprising a plurality of connecting supports, a plurality of lead frame units and an anti-corrosion pre-plated metal layer, with each guide frame unit provided with a plurality of junction, and the anti-corrosion pre-plated metal layer covering the junctions and one inner surface of every connecting support; providing a chip fixed within the guide frame units; electrically connecting the chip and the anti-corrosion pre-plated metal layer on the junctions through a plurality of electrical connecting elements; covering the chip, the electrical connecting elements and the anti-corrosion pre-plated metal layer by package glue; setting an anti-etching mask on an outer surface of each junction, and exposing the masks from the connecting supports; etching the anti-etching mask to expose the connecting supports so as to form an etching groove, exposed from the anti-corrosion pre-plated metal layer; removing the anti-etching masks; and cutting part of the anti-corrosion pre-plated metal layer and the package glue, located a cutting groove, so as to separate a plurality of package structures.

Description

technical field [0001] The present invention relates to a semiconductor packaging structure without external leads and its manufacturing method and lead frame strip, in particular to a lead frame strip with an anti-corrosion pre-plated metal layer. In the manufacturing process, pre-etching An etching groove is used to protect the cutting jig and increase the cutting efficiency and the quality of the packaging structure. The semiconductor packaging structure without external leads and its manufacturing method and lead frame strip. Background technique [0002] Nowadays, in order to meet the needs of various high-density packaging, the semiconductor packaging industry has gradually developed various types of packaging structures, and these packaging structures usually use leadframes or packaging substrates as the chip-carrying structures. The carrier board (carrier), where the common package structure using a lead frame is, for example, a small outline package structure (small...

Claims

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Application Information

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IPC IPC(8): H01L21/60H01L21/50H01L23/495
CPCH01L24/97H01L24/73H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/73265H01L2224/97H01L2924/181H01L2224/85H01L2924/00012H01L2924/00H01L2924/00014
Inventor 胡迎花
Owner ASE (KUNSHAN) INC
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