Three proofing method of firefighting electronic product printed circuit board (PCB) through matched electronic wax

Abstract

The invention discloses a three proofing method of a firefighting electronic product PCB through matched electronic wax and relates to the technical field of protection of the firefighting electronic product PCB. Soft electronic wax with dropping-melting points of 62 DEG C and 82 DEG C is matched in proportion respectively and heated to be molten and mixed in three sections in a dedicated waxing device; the PCB is placed in the melted and mixed wax liquid for dip coating, and taken out and placed on a board inserting rack vertically when the dip coating time is up; a blowing device is used for accelerating the flow of extra wax fluids; and the next process is performed after the PCB is dried. The three proofing method has the obvious advantages of being simple in operation, short in cycle, low in price, good in 'three proofing' effect, unaffected on welding, lossless in repair and capable of greatly improving the production efficiency.

Description

Technical field: [0001] The invention relates to the technical field of protection for circuit boards of fire-fighting electronic products, in particular to a method for dip-coating the circuit boards of fire-fighting electronic products in a proportioned electronic wax liquid by using a special wax dipping device to realize three-proof protection of the circuit boards. Background technique: [0002] Fire detectors, alarm buttons, modules and other system components in fire-fighting electronic products are widely used in a wide range of areas, and the climate and environment vary greatly, and some areas have harsh environments. Especially the basements of residential quarters in coastal areas are characterized by high temperature, humidity, salt spray corrosion and dust accumulation. To ensure long-term reliable operation of the product, the circuit board needs to be treated with "three defenses" against moisture, salt spray, and mildew. For the northern region, products ar...

AI Technical Summary

Problems solved by technology

[0008] The main problems in the existing technology: the "three-proof" process is complicated and the cycle is long, which is the main bottleneck affecting the manufacturing cycle for system components that require fast flow and mass production; the solvent-xylene has certain toxicity and is harmful to the operator's body Hazardous to health; the effect of spraying and brushing is often unsatisfactory, and some areas of the circuit board are not protected (shadow); if the coating is repaired after spraying and brushing, the coating layer will be damaged; the material is easy to cure and fail after poor storage and contact with air

[0009] Special waxes with low dripping melting points cannot meet the working temperature requirements of fire protection electronic system components; special waxes with high dripping melting points are prone to cracking in low temperature environments, resulting in reduced protective performance

Potting is not possible for circuit boards that utilize metal parts or gold fingers for electrical connections

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