The invention relates to the technical field of
semiconductor machining, and discloses a leading wire bonder. The bonder comprises a
chopper, a sliding sleeve is slidingly mounted on the
chopper, thebottom of the sliding sleeve is fixedly connected with an iron bar, the iron bar is wound with a wire, the end of the wire is connected with a power source in a driving device, the bottom of the ironbar is fixedly connected with an iron ring, an adjusting device is bonded on the
chopper, through connection between the wire and the power source of the driving device, the running speed of the chopper is higher, the higher the speed is, the rapier the contact between the chopper and a
welding disc is, the larger the
friction coefficient is, the rapier the wear of the chopper is, the larger the generated current is, the larger the magnetic force generated by the iron ring is, through the principle of homopolar repulsion of a
magnet, a magnetic block is ejected, a rubber cylinder moves downwards, the end of the chopper is covered, when the chopper makes contact with a
welding disc each time, through elastic strength of the rubber cylinder, the contact area and the
contact strength betweenthe chopper and the
welding disc can be reduced, and friction between the chopper and the welding disc is reduced.