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Production process for copper-clad plates

A treatment process and copper clad laminate technology, which is applied in the field of copper clad laminate production and treatment process, can solve the problems of false soldering, easy oxidation, virtual soldering, etc., and achieve good heat resistance, low dielectric constant, and reduce dielectric loss.

Active Publication Date: 2019-09-20
JIANGXI PROVINCE HANGYU NEW MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the development of copper clad laminate materials, the proportion of glue is more and more complicated. The quality of glue will directly affect the heat resistance, dielectric constant and peel strength of copper clad laminate, etc. The production process of copper clad laminate has great influence on These properties of the copper plate have a key influence; and the surface of the copper foil of the copper clad laminate is easy to oxidize, and the oxide layer of copper has a great influence on the welding, which is easy to form false welding and virtual welding, and in severe cases, it will cause the pads and components to fail. welding

Method used

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  • Production process for copper-clad plates

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Effect test

Embodiment 1

[0044] A kind of copper-clad laminate production process is provided in embodiment 1,

[0045] S1: Provide copper foil, glass fiber paper, glass fiber cloth, and prepare the first resin glue, the second resin glue, and OSP prepreg;

[0046] The second resin glue is composed of the following components in parts by weight:

[0047] 23 parts of phosphorus-containing epoxy resin, 8 parts of spherical silicon powder, 6 parts of phenolic epoxy resin, 7 parts of polyarylate, 15 parts of alicyclic epoxy resin and 7 parts of graphene;

[0048] The first resin glue is composed of the following components in parts by weight:

[0049] 12 parts of phenol, 6 parts of cardanol, 2 parts of spherical silicon powder, 7 parts of alicyclic epoxy resin and 5 parts of formaldehyde; the epoxy equivalent of the alicyclic epoxy resin is 150g / eq;

[0050] Described OSP prepreg is made up of following components by weight:

[0051] 25 parts of 2,3-dihydro-1,4 naphthoquinone, 4 parts of ethylenediamin...

Embodiment 2

[0066] Embodiment 2 provides a kind of copper-clad laminate production process,

[0067] S1: Provide copper foil, glass fiber paper, glass fiber cloth, and prepare the first resin glue, the second resin glue, and OSP prepreg;

[0068] The second resin glue is composed of the following components in parts by weight:

[0069] 20 parts of phosphorus-containing epoxy resin, 5 parts of spherical silicon powder, 5 parts of phenolic epoxy resin, 6 parts of polyarylate, 10 parts of alicyclic epoxy resin and 5 parts of graphene;

[0070] The first resin glue is composed of the following components in parts by weight:

[0071] 11 parts of phenol, 5 parts of cardanol, 2 parts of spherical silicon powder, 6 parts of cycloaliphatic epoxy resin and 3 parts of formaldehyde; the epoxy equivalent of the cycloaliphatic epoxy resin is 100g / eq;

[0072] Described OSP prepreg is made up of following components by weight:

[0073] 20 parts of 2,3-dihydro-1,4 naphthoquinone, 3 parts of ethylenedi...

Embodiment 3

[0088] Embodiment 3 provides a copper clad laminate production process,

[0089] S1: Provide copper foil, glass fiber paper, glass fiber cloth, and prepare the first resin glue, the second resin glue, and OSP prepreg;

[0090] The second resin glue is composed of the following components in parts by weight:

[0091] 25 parts of phosphorus-containing epoxy resin, 10 parts of spherical silicon powder, 10 parts of phenolic epoxy resin, 8 parts of polyarylate, 20 parts of alicyclic epoxy resin and 10 parts of graphene;

[0092] The first resin glue is composed of the following components in parts by weight:

[0093] 13 parts of phenol, 8 parts of cardanol, 2 parts of spherical silicon powder, 8 parts of alicyclic epoxy resin and 4 parts of formaldehyde; the epoxy equivalent of the alicyclic epoxy resin is 200g / eq;

[0094] Described OSP prepreg is made up of following components by weight:

[0095] 30 parts of 2,3-dihydro-1,4 naphthoquinone, 5 parts of ethylenediamine, 40 parts...

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Abstract

The invention discloses a production process for copper-clad plates, and belongs to the technical field of production of the copper-clad plates. The production process has the advantages that through a scientific and reasonable formula and an advanced extraction process, dielectric constants of the copper-clad plates are well reduced, so that the dielectric loss is reduced, and the copper-clad plates have high heat resistance; the possibility of oxidation of the copper-clad plates is greatly lowered, and the welding efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of production of copper clad laminates, and more specifically relates to the production and treatment process of copper clad laminates. Background technique [0002] The miniaturization and multi-function of electronic products, especially the miniaturization and high performance of consumer electronic products have become an obvious trend, which requires PCB to achieve high density and high performance. As the insulating substrate of printed circuit boards, copper clad laminates are widely used in various electronic and electrical products. High requirements, among which heat resistance is an important reliability index of copper clad laminates, copper clad laminates with poor heat resistance can easily cause damage to electronic products, and even become a potential hidden danger of fire. [0003] In the field of copper clad laminates, the existing manufacturing methods of copper clad laminates usually in...

Claims

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Application Information

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IPC IPC(8): B32B37/10B32B15/14B32B17/02B32B17/06B32B15/04B32B15/20B32B38/08B32B38/00C08L63/00C08L61/06C08L67/00C08K3/04C08K7/18H05K3/02
CPCB32B5/02B32B15/04B32B15/14B32B15/20B32B37/10B32B38/00B32B38/08B32B2250/40B32B2255/02B32B2255/26B32B2262/101B32B2307/306B32B2307/714B32B2457/08C08L61/06C08L63/00C08L2203/20C08L2205/025C08L2205/03H05K3/022C08L67/00C08K3/042C08K7/18
Inventor 张运东
Owner JIANGXI PROVINCE HANGYU NEW MATERIAL CO LTD
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