13 results about "Copper contamination" patented technology

Provided is a sealing member which is capable of suppressing the occurrence of cracks or the like during mold release in a mold molding step and which has excellent copper contamination resistance. A sealing member comprising a crosslinked body of a rubber composition containing the following components (A) to (E), the ethylene content of the component (A) being 50 mass% or more, the content of the component (B) being 30-90 parts by mass, the content of the component (D) being 0.5-10 parts by mass, and the content of the component (E) being 3-10 parts by mass per 100 parts by mass of the component (A). (A) at least one of an ethylene-propylene-diene rubber and an ethylene-butylene-diene rubber, (B) silica, (C) an organic peroxide, (D) a benzimidazole-based anti-aging agent, and (E) zinc oxide.

To provide a recycling method of a lithium ion secondary battery which does not require discharge by a resistor and can suppress generation of copper contamination in a positive electrode.SOLUTION: A method for recycling a used lithium ion secondary battery including a laminate having a positive electrode, a separator, and a negative electrode, an exterior body accommodating the laminate, and an electrolytic solution, the method comprising: a first step of exposing the laminate to a gas containing water vapor through the electrolytic solution; and a second step of converting lithium ions contained in the negative electrode into a lithium compound.SELECTED DRAWING: None

The invention relates to the technical field of mining area copper pollution monitoring, in particular to a mining area copper pollution monitoring method and system based on multi-order fusion high-dimensional spectral indexes. The method comprises the following steps: extracting pixel spectral data and copper element content corresponding to a quadrat based on a soil sample; performing multi-order fractional derivative transformation on the pixel spectrum to generate a plurality of groups of fractional derivative spectrums; calculating a plurality of three-dimensional spectral indexes according to the fractional derivative spectrum, screening a core three-dimensional spectral index from the three-dimensional spectral indexes, and fusing the core three-dimensional spectral indexes to obtain a multi-order fused high-dimensional spectral index; and constructing a data set by combining the multi-order fusion high-dimensional spectral index and the copper element content, training a mining area copper pollution monitoring model by using the data set, and completing mining area copper pollution monitoring through the trained mining area copper pollution monitoring model. According to the invention, through multi-order fractional derivative transformation, three-dimensional spectral index construction and multi-order fusion high-dimensional spectral index generation, accurate monitoring of copper pollution in the mining area is realized.

The invention relates to the technical field of conductive paste, and provides conductive paste and a solar cell, the conductive paste comprises first silver paste, second silver paste and silver nickel paste, the first silver paste comprises 82-90 parts by weight of first silver powder, 2-6 parts by weight of first glass powder, 0.05-1.0 part by weight of a first auxiliary agent and 6-10 parts by weight of an organic carrier, and the softening point of the first glass powder is 300-400 DEG C; the second silver paste comprises 80-88 parts of second silver powder, 2-6 parts of second glass powder, 0.05-1.0 part of a second auxiliary agent and 5-15 parts of an organic carrier, and the softening point of the second glass powder is 350-450 DEG C; the silver-nickel paste comprises 60-80 parts of silver-nickel metal powder, 3-8 parts of third glass powder, 0.05-1.0 part of a third auxiliary agent and 8-12 parts of an organic carrier, and the softening point of the third glass powder is 400-500 DEG C. Therefore, the conductive paste is low in cost, good in conductivity and free of copper pollution risk.

This invention relates to the field of livestock and poultry breeding and food safety testing technology, and in particular to a method for assessing copper exposure hepatotoxicity based on the endoplasmic reticulum stress-endoplasmic reticulum autophagy axis and its application. This method obtains liver tissue samples or in vitro cultured hepatocyte samples from copper-exposed subjects, and jointly detects the expression levels of key markers of the endoplasmic reticulum stress pathway and characteristic markers of the endoplasmic reticulum autophagy pathway. Combined with two-way pharmacological validation, a grading assessment standard for copper exposure hepatotoxicity is established. This invention overcomes the shortcomings of traditional liver enzyme indicators, such as low sensitivity and strong lag, and has the advantages of early warning, high specificity, and reliable results. It can be widely applied to scenarios such as determining the copper safety threshold in livestock and poultry feed, early screening for copper exposure hepatotoxicity, assessment of copper pollution ecological risks, and screening of copper toxicity protectants, providing technical support for ensuring animal health and the safety of animal-derived food.

This invention provides a chemical mechanical polishing (CMP) slurry for exposing copper on the back side of through-silicon vias (TSVs). The slurry comprises abrasive particles, organic acids, organic amines, nitrazole compounds, nonionic surfactants, and an oxidant. The CMP slurry of this invention maintains a high single-crystal silicon removal rate and an adjustable copper removal rate, while effectively reducing copper contamination on the silicon surface after polishing.

The invention discloses application of baicalin in relieving copper toxicity of duckweed, and belongs to the technical field of plant adversity physiology and heavy metal pollution remediation. Systematic research on the physiological regulation mechanism of baicalin on duckweed under copper stress innovatively discovers that the relative growth rate of duckweed can be remarkably increased through treatment of baicalin; according to the application, the chlorophyll synthesis level is effectively recovered, the photosynthesis inhibition effect caused by copper toxicity is fundamentally improved, it is proved that the threshold concentration for effectively relieving the copper toxicity is 400 [mu] M, the optimal action concentration window is 200-800 [mu] M, and the concentration interval can achieve synergistic antagonism on the toxicity of copper ions by adjusting the antioxidant metabolic pathway of duckweed. And a green and efficient new strategy is provided for heavy metal polluted water body remediation. The method is not only suitable for ecological restoration engineering of copper-polluted water areas, but also can be expanded and applied to cultivation of stress-resistant varieties of aquatic economic plants, and has important theoretical value and practical application prospect in improvement of heavy metal tolerance of stressed plants.

The application provides a method for reducing the content of copper atoms in a cavity, and relates to the technical field of semiconductor processes, and is designed to solve the problems of high cost, more manpower and time occupied in the method for controlling copper pollution provided by related technologies. The method for reducing the content of copper atoms in the cavity comprises the following steps: heating the cavity to a preset temperature; introducing an oxygen-containing gas into the cavity, and reacting the oxygen-containing gas with copper atoms in the cavity to form copper oxide; and introducing a purge gas into the cavity, and using the purge gas to carry the copper oxide out of the cavity. The method for reducing the content of copper atoms in the cavity by using the chemical reaction between the oxygen-containing gas and the copper atoms at high temperature not only reduces the cost without replacing the expensive equipment components, but also saves manpower and time without regularly disassembling and cleaning the equipment components.

This invention relates to a composite capacitor (MIM) comprising a composite capacitor top metal (CTM) electrode and a composite capacitor bottom metal (CBM) electrode. The composite CBM electrode includes a first diffusion barrier layer covering a first metal layer, and the composite CTM electrode includes a second diffusion barrier layer covering a second metal layer. A dielectric layer is disposed above the composite CBM electrode and below the composite CTM electrode. The first and second diffusion barrier layers protect the first and second metal layers from metals that diffuse or migrate from metal lines beneath the MIM capacitor to the composite CTM and CBM electrodes during manufacturing. The invention also provides a method for manufacturing the MIM capacitor.

The embodiment of the present application discloses a semiconductor manufacturing method with a copper diffusion barrier layer structure, comprising: depositing a dielectric layer; etching the dielectric layer to open a groove; depositing a first diffusion barrier layer in the groove; forming a copper metal layer above the first diffusion barrier layer; grinding the copper metal layer to present a disc type structure; depositing a second diffusion barrier layer on the surface of the copper metal layer by a deposition method with a negative bias; and grinding the second diffusion barrier layer. The present application can completely prevent the hole phenomenon by depositing the metal barrier layer in the copper wire process in the form of a process with a negative bias and covering the exposed copper metal surface after chemical grinding, forming a full-enclosing structure with the side and bottom to the copper metal, effectively inhibiting the copper diffusion phenomenon caused by the hole problem, preventing copper pollution in the subsequent process, and ensuring the product yield and device performance.

The present invention provides a chemical-mechanical polishing solution for backside copper reveal process of through silicon vias. The polishing solution comprises abrasive particles, an organic acid, an organic amine, an azole compound, a non-ionic surfactant, and an oxidizing agent. The chemical-mechanical polishing solution of the present invention can maintain a relatively high monocrystalline silicon removal rate and an adjustable copper removal rate, and can also effectively reduce copper contamination on a polished silicon surface.

The invention discloses a modified biochar material for repairing copper-polluted planting soil and a preparation method of the modified biochar material, and belongs to the technical field of ecological restoration. The preparation method comprises the following steps: firstly, cleaning, drying and crushing tobacco straws, pyrolyzing at 600 DEG C, cooling, soaking in a 0.1 mol / L HCl solution overnight, carrying out suction filtration, washing, and drying to obtain original biochar; ball-milling the original biochar, uniformly mixing with 0.5 mol / L of MgCl2 solution, drying, carrying out secondary pyrolysis and cooling to obtain the magnesium chloride modified biochar, and carrying out ball-milling treatment to obtain a final product. The biochar material subjected to magnesium chloride and ball milling treatment is rich in pore structure, and the chelating ability with copper ions is enhanced, so that the bio-availability of the copper ions in the soil is reduced, the soil quality is improved, plant growth is promoted, and the biochar material is suitable for large-scale application in copper-contaminated soil remediation.

A sealing element is provided that can suppress the occurrence of cracks and the like during demolding in a compression molding process and that exhibits excellent resistance to copper contamination. The sealing element comprises a cross-linked product of a rubber composition containing components (A) to (E), wherein the ethylene content of component (A) is 50% by weight or more, the content of component (B) is 30 to 90 parts by weight, the content of component (D) is 0.5 to 10 parts by weight, and the content of component (E) is 3 to 10 parts by weight, based on 100 parts by weight of component (A). (A) is at least one of an ethylene propylene diene monomer rubber and an ethylene butene diene monomer rubber, (B) is silica, (C) is organic peroxide, (D) is a benzimidazole-based antioxidant, and (E) is zinc oxide.