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Integrated switching power supply device and electric apparatus

A technology of catalysts and antioxidants, applied in physical/chemical process catalysts, liquid chemical plating, catalyst activation/preparation, etc., can solve the problem of no alternative catalysts

Inactive Publication Date: 2013-04-10
ROHM & HAAS ELECTRONICS MATERIALS LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Other metal colloids have been reported in the literature, such as silver / palladium and copper / palladium in which palladium is partially replaced by non-noble metals; however, there are no commercially acceptable alternative catalysts to date
Ionic palladium variants have been used commercially, but require an additional reduction step

Method used

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  • Integrated switching power supply device and electric apparatus
  • Integrated switching power supply device and electric apparatus
  • Integrated switching power supply device and electric apparatus

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0076] Preparation of carboxymethylcellulose / silver catalyst: Dissolve 175 mg of sodium salt of carboxymethylcellulose in 500 ml of deionized water in a beaker at room temperature. While stirring, add 637.5mgAgNO 3 10 ml of deionized water, and then stir the mixture vigorously. Under vigorous stirring, will contain 150mg NaBH 4 10ml of deionized water was added to the mixed solution. The solution quickly changed from colorless to reddish brown, which signifies the reduction of silver ions to silver metal. The pH of the synthesized catalyst solution was measured between 8 and 9 with an ACCUMETAB 15 pH meter. The beaker containing the aqueous catalyst solution was placed in a water bath at 50°C for at least 12 hours to check its stability. The solution was observed after 12 hours and no visible precipitate indicated that the catalyst remained stable.

[0077] The catalyst solution was used as the stock solution, and 2 aliquots were diluted to a nanoparticle concentration of...

Embodiment 2

[0098] A 400 ppm aqueous solution of carboxymethylcellulose / silver catalyst was prepared as described in Example 1. The pH of the aqueous catalyst solution was adjusted to 3.5 with gallic acid. Six types of thin plates containing a plurality of through holes as described above are provided. Conductive vias were produced using the same method steps and the parameters of the surface treatment of the sheets were as described in Example 1. After application of the catalyst, the vias were electrolessly plated using the same electroless copper bath as described in Example 1.

[0099] After plating each board was sliced ​​to expose the copper plated walls of the vias. Multiple 1 mm thick sections were taken from the sliced ​​via walls of each plate to determine the coverage of the via walls of the plates. Use the European Backlight Grading Scale. 1 mm sections taken from each plate were placed under a conventional optional 50X magnification microscope. The amount of copper depos...

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Abstract

Catalysts include nanoparticles of catalytic metal and cellulose or cellulose derivatives. The catalysts are used in electroless metal plating. The catalysts are free of tin.

Description

technical field [0001] The present invention relates to stable aqueous catalyst solutions for electroless plating. Further, the present invention relates to a stable aqueous catalyst solution for electroless plating that is free of tin and stabilized by cellulose and cellulose derivatives. Background technique [0002] Electroless metal deposition is a well known method for depositing metal layers on substrate surfaces. Electroless plating on insulator surfaces requires prior application of a catalyst. The most common method of catalyzing or activating insulators, such as the non-conductive parts of thin-sheet substrates used in the production of printed circuit boards, is to treat the substrate with an aqueous tin / palladium colloid in an acidic chloride medium. The structure of colloids has been extensively studied. Generally speaking, colloids comprise a palladium metal core surrounded by a stabilizing layer of tin ions (II), which are essentially SnCl as surface stabil...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/18C23C18/30B01J31/06
CPCB01J2531/17C23C18/32B01J23/50C23C18/38C23C18/2086B01J35/0013C23C18/30B01J23/48B01J2531/0272B01J23/40C23C18/31B01J37/16B01J23/70B01J31/28B01J31/061B01J35/23B01J31/06B01J23/44C08L71/00C23C18/1633C23C18/1803
Inventor 刘锋M·A·热兹尼克
Owner ROHM & HAAS ELECTRONICS MATERIALS LLC