Integrated switching power supply device and electric apparatus
A technology of catalysts and antioxidants, applied in physical/chemical process catalysts, liquid chemical plating, catalyst activation/preparation, etc., can solve the problem of no alternative catalysts
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0076] Preparation of carboxymethylcellulose / silver catalyst: Dissolve 175 mg of sodium salt of carboxymethylcellulose in 500 ml of deionized water in a beaker at room temperature. While stirring, add 637.5mgAgNO 3 10 ml of deionized water, and then stir the mixture vigorously. Under vigorous stirring, will contain 150mg NaBH 4 10ml of deionized water was added to the mixed solution. The solution quickly changed from colorless to reddish brown, which signifies the reduction of silver ions to silver metal. The pH of the synthesized catalyst solution was measured between 8 and 9 with an ACCUMETAB 15 pH meter. The beaker containing the aqueous catalyst solution was placed in a water bath at 50°C for at least 12 hours to check its stability. The solution was observed after 12 hours and no visible precipitate indicated that the catalyst remained stable.
[0077] The catalyst solution was used as the stock solution, and 2 aliquots were diluted to a nanoparticle concentration of...
Embodiment 2
[0098] A 400 ppm aqueous solution of carboxymethylcellulose / silver catalyst was prepared as described in Example 1. The pH of the aqueous catalyst solution was adjusted to 3.5 with gallic acid. Six types of thin plates containing a plurality of through holes as described above are provided. Conductive vias were produced using the same method steps and the parameters of the surface treatment of the sheets were as described in Example 1. After application of the catalyst, the vias were electrolessly plated using the same electroless copper bath as described in Example 1.
[0099] After plating each board was sliced to expose the copper plated walls of the vias. Multiple 1 mm thick sections were taken from the sliced via walls of each plate to determine the coverage of the via walls of the plates. Use the European Backlight Grading Scale. 1 mm sections taken from each plate were placed under a conventional optional 50X magnification microscope. The amount of copper depos...
PUM
| Property | Measurement | Unit |
|---|---|---|
| particle size | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 