Simple and easy preparation method of ultra-micro electrode

Abstract

The invention discloses a simple and easy preparation method of an ultra-micro electrode. The simple and easy preparation method comprises the following steps: connecting an electrode fiber material and a current collector, removing electrode fiber impurities, modulating epoxy resin, fixing an electrode fiber by the epoxy resin, and cleaning the electrode fiber. According to the simple and easy preparation method provided by the invention, can very conveniently prepare various ultra-micro electrodes specific to materials with various properties can be prepared by improving an epoxy resin modulation method according to the liquid-phase solidification property of the epoxy resin in a normal temperature condition; the preparation condition is simple; and the success rate is high.

Description

technical field [0001] The invention relates to the field of electrochemistry, in particular to a simple preparation method of an ultramicro electrode. Background technique [0002] Due to its own characteristics, ultra-micro electrodes have been widely used in many aspects, and can be used as ion-selective electrodes, biosensors, gas sensors, clinical analysis, living body determination of oxygen content in blood, inspection of food freshness, and detection of oxygen in water. Heavy metal ions, etc., the material transfer rate on ultra-micro electrodes is very fast, the charging current is small, which can significantly improve the sensitivity of analysis, and the influence of convection and hydrodynamics is almost negligible. Therefore, ultra-micro electrodes will be more widely used. [0003] Commonly used ultramicro electrode materials include carbon fiber, metal fiber and alloy fiber. For the preparation of ultramicro electrodes, there are flame etching method, ion beam...

AI Technical Summary

Problems solved by technology

More active metals such as nickel will oxidize rapidly at high temperature, and the expected finished product cannot be obtained

The expansion coefficient of some materials is quite different from that of glass, and it is very easy to have a small gap between the metal and the glass during heat sealing, resulting in the poor sealing of the electrode and making it unusable

In addition, the defect of the heat-sealing method itself is that the glass is easy to form fine air bubbles during the heat-sealing process, which further reduces the success rate of the method.

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