Sequential browning and green paint brushing-based flat package manufacturing process
A manufacturing process and flat packaging technology, applied in semiconductor/solid-state device manufacturing, electrical components, electrical solid-state devices, etc., to achieve broad market application prospects, high production efficiency, and easy-to-operate methods
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Embodiment 1
[0031] The first step, thinning: thinning thickness is 100μm, roughness Ra 0.10um;
[0032] The second step, dicing: use a wafer with a thickness of 100 μm, use a double-knife dicing machine and its process;
[0033] The third step, core: use adhesive 2 to core;
[0034] The fourth step, pressure welding: the same as the conventional AAQFN process;
[0035] The fifth step, one-time plastic sealing: use traditional plastic sealing compound 9920 for plastic sealing, which is the same as the conventional AAQFN process;
[0036] The sixth step, post-curing: the same as the conventional AAQFN process;
[0037] Step 7: Etching the groove on the back of the thin frame: using a thin frame, use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half the thickness of the frame;
[0038] The eighth step, browning, brushing green paint;
[0039] The ninth step, post-curing, grinding, tinning, printin...
Embodiment 2
[0041] The first step, thinning: thinning thickness is 130μm, roughness Ra 0.20um;
[0042] The second step, dicing: use a wafer with a thickness of 130 μm, use a double-knife dicing machine and its process;
[0043] The third step, core: use adhesive 2 to core;
[0044] The fourth step, pressure welding: the same as the conventional AAQFN process;
[0045] The fifth step, one-time plastic sealing: use traditional plastic sealing compound 9920 for plastic sealing, which is the same as the conventional AAQFN process;
[0046] The sixth step, post-curing: the same as the conventional AAQFN process;
[0047] Step 7: Etching the groove on the back of the thin frame: using a thin frame, use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half the thickness of the frame;
[0048] The eighth step, browning, brushing green paint;
[0049] The ninth step, post-curing, grinding, tinning, printin...
Embodiment 3
[0051] The first step, thinning: the thinning thickness is 170μm, and the roughness Ra is 0.30um;
[0052] The second step, dicing: use a wafer with a thickness of 170 μm, which is the same as the ordinary QFN scribing process;
[0053] The third step, core: use adhesive 2 to core;
[0054] The fourth step, pressure welding: the same as the conventional AAQFN process;
[0055] The fifth step, one-time plastic sealing: use traditional plastic sealing compound 9920 for plastic sealing, which is the same as the conventional AAQFN process;
[0056] The sixth step, post-curing: the same as the conventional AAQFN process;
[0057] Step 7: Etching the groove on the back of the thin frame: using a thin frame, use ferric chloride solution to do partial window half-etching on the back of the frame to form a groove, and the depth is controlled within half the thickness of the frame;
[0058] The eighth step, browning, brushing green paint;
[0059] The ninth step, post-curing, grindi...
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