Taper-controllable laser micropore machining light beam scanning device and control method thereof

A technology of micro-hole processing and beam scanning, which is applied in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve the problems of non-adjustable reverse taper hole taper, high installation accuracy requirements, large energy loss, etc., and achieve cost reduction , high precision, simple control effect

Active Publication Date: 2013-04-24
CHINA KEHAN LASER FUJIAN
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

It can be combined with the parallel plate to realize the processing of the inverted cone hole, but because the beam translation amount of the parallel plate is fixed, the taper of the inverted cone hole can not be adjusted
Parallel double optical wedges can overcome the shortcomings of parallel flat plates, but the combination...

Method used

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  • Taper-controllable laser micropore machining light beam scanning device and control method thereof
  • Taper-controllable laser micropore machining light beam scanning device and control method thereof
  • Taper-controllable laser micropore machining light beam scanning device and control method thereof

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Embodiment Construction

[0030] Such as figure 1 The experimental device shown is composed of a laser 1, a beam expander 2, a 45° reflector 3, a first large wedge angle wedge 4, a second large wedge angle wedge 5, a small wedge angle wedge 6, a focusing mirror 7, It consists of a sample to be processed 8, a clamping platform 9 and a computer 10 for controlling the movement of the optical wedge. When working, the three optical wedges are driven to rotate by the drive motors 12 and 13, and the laser beam punches holes on the surface of the sample 8 to be processed.

[0031] The laser beam is collimated by the beam expander, and the collimated light is then vertically incident on the non-parallel optical wedge group formed by the first large wedge angle 4 and the second large wedge angle 5 through the 45° reflector 3, and the non-parallel light The wedge group can produce a certain inclination and translation to the beam, which is equivalent to a pair of parallel optical wedge groups 4', 5' and a small ...

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Abstract

The invention relates to a taper-controllable laser micropore machining light beam scanning device. The device comprises a laser device and a sample piece to be machined, wherein a beam expander is arranged on the emergent surface of the laser device; a 45-degree reflecting mirror is arranged on the emergent surface of the beam expander; a non-parallel double optical wedge group and a small-angle optical wedge are vertically distributed below the 45-degree reflecting mirror in sequence; a focusing mirror and the sample piece to be machined are vertically distributed below the small-angle optical wedge in sequence; and a laser beam is expanded and collimated by the beam expander, is emitted to the 45-degree reflecting mirror, is reflected by the 45-degree reflecting mirror, is vertically emitted to the non-parallel double optical wedge group below the 45-degree reflecting mirror and is translated and deflected to a certain degree through the non-parallel double optical wedge group, and the deflected beam is refracted to the focusing mirror through the small-angle optical wedge, and is focused on the sample piece to be machined by the focusing mirror. Compared with a galvanometric scanning micropore machining device, the device is high in accuracy; the number of the optical wedges is reduced by one, so that the device is convenient to mount; the number of driving motors and wedge mirrors is reduced by one, so that the device is easy to control; and the loss of laser energy is reduced, and cost is greatly reduced.

Description

technical field [0001] The invention belongs to the field of laser processing, and in particular relates to a beam scanning device capable of realizing microhole processing and adjustable control of taper. Background technique [0002] Microhole processing is one of the important applications in the field of laser processing. In microhole processing, the hole shape often has a certain taper requirement, and even requires an inverted taper hole. For example, in the micro-hole processing of fuel injectors, in order to improve the atomization effect of the small hole of the fuel injector, not only the aperture is required to be small, but also the hole shape is required to have a certain reverse taper; in the processing of aircraft blades, in order to improve the micro-pore The cooling effect requires the hole to be a positive cone. [0003] The existing methods of laser machining microholes include: single-pulse or multi-pulse processing of unit microholes with a fixed beam, ...

Claims

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Application Information

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IPC IPC(8): B23K26/08B23K26/38B23K26/382
Inventor 李朋杨小君李明赵华龙赵卫
Owner CHINA KEHAN LASER FUJIAN
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