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Resin protective sizing agent and preparation method thereof

A slurry and resin technology, applied in the field of resin protection slurry and its preparation, can solve the problems of strong irritation, strong resin smell, human injury, etc., and achieve the effect of weak irritation, low odor and strong solubility

Active Publication Date: 2015-06-17
广东风华特种元器件股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Most of the domestically produced modified epoxy resins are dissolved by toluene, xylene and other organic solvents. The resin has a strong odor, strong irritation, and sharp damage to the human body, so it is not suitable for personnel-intensive batch production Production

Method used

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  • Resin protective sizing agent and preparation method thereof

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Embodiment Construction

[0013] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and examples of implementation. It should be understood that the specific implementation cases described here are only used to explain the present invention, and are not intended to limit the present invention.

[0014] A kind of resin protection paste, it comprises modified epoxy resin, organic solvent, silica aluminum powder and dispersant, the mass percent content of described modified epoxy resin is 20%-60%, the mass percentage of described organic solvent The percentage content is 8%-12%, the mass percentage content of the silica-alumina powder is 30%-60%, and the mass percentage content of the dispersant is 2%-8%.

[0015] Among them, epoxy resin is used as the functional phase. It is a white uniform powder with good physical and chemical stability. The appear...

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Abstract

The invention is applicable to the technical field of electronic materials and provides a resin protective sizing agent. The resin protective sizing agent comprises the following components in percentage by weight: 20%-60% of modified epoxy resin, 8%-12% of organic solvent, 30%-60% of aluminum silicon powder and 2%-8% of dispersing agent, wherein the organic solvent is butyl carbitol. The invention further provides a preparation method for the resin protective sizing agent.

Description

technical field [0001] The invention belongs to the technical field of materials, and relates to a resin protection slurry and a preparation method thereof. Background technique [0002] With the continuous design of electronic equipment in the direction of shortness, lightness and thinness, the rapid development of surface mount technology (SMT) and surface mount components (SMC) has been encouraged, especially in the past ten years, the rapid development of communications, computers, and networks. As one of the three major passive components, the demand for chip resistors is growing rapidly, and they are widely used in electronic equipment and household appliances. According to statistics, the current annual production capacity of chip resistors in my country has reached 500 billion pieces, and the demand for resin protection paste is huge. [0003] Due to technical reasons, the current technology leaders of resin paste are mainly Japan and Taiwan. Domestic chip resistor ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08K3/34C09D163/00C09D7/12
Inventor 刘军山王作华张鹏
Owner 广东风华特种元器件股份有限公司