High-heat-conductivity flexible silica gel gasket and preparation method thereof

A silica gel gasket and high thermal conductivity technology, which is applied in the field of silica gel gasket and its preparation, can solve the problems of limited application range, poor thermal conductivity of silica gel mat, insufficient thermal conduction channels of thermal silica gel, etc., to improve flexibility, thermal conductivity, and thermal conductivity Improvement, good effect of flexibility

Active Publication Date: 2013-04-24
SHENZHEN HFC SHIELDING PRODS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Heat is mainly transferred through three ways: heat conduction, heat convection and heat radiation. For heat-conducting silica gel, its main heat-conducting mechanism is through heat conduction. T

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] A flexible silicone gasket with high thermal conductivity, prepared according to the following steps:

[0043] (1) Modification of alumina particles: 1 part by weight of silane coupling agent is dissolved in ethanol with a mass concentration of 95% to form a solution with a mass concentration of 5%, and stirred until the coupling agent is completely dissolved; 500 parts by weight of Add large spherical alumina particles into the silane coupling agent alcohol solution, stir for 2 hours, dry at 150°C for 2h, and then dry at 200°C for 1h to obtain modified large spherical alumina particles. The medium particle and the small particle are modified by the method, and put into the dry box for subsequent use;

[0044] (2) Add 80 parts by weight of vinyl silicone oil and 40 parts by weight of simethicone oil into the container, stir evenly, and then add 900 parts by weight of three kinds of modified spherical alumina particles with different particle sizes, three The mass ratio...

Embodiment 2

[0050] A flexible silicone gasket with high thermal conductivity, prepared according to the following steps:

[0051] (1) Pretreatment of alumina particles: 0.2 parts by weight of silane coupling agent is dissolved in ethanol with a mass concentration of 95% to form a solution with a mass concentration of 10%, and stirred until the coupling agent is completely dissolved; 100 parts by weight The large spherical alumina particles were added to the silane coupling agent alcohol solution, stirred for 1 hour, dried at 150°C for 2h, and then dried at 200°C for 1h to obtain modified large spherical alumina particles. The same method is used to modify the medium and small particles, and put them in a dry box for subsequent use;

[0052](2) Add 60 parts by weight of vinyl silicone oil and 50 parts by weight of simethicone oil into the container, stir evenly, and then add 800 parts by weight of three kinds of modified spherical alumina particles with different particle sizes. The mass ...

Embodiment 3

[0058] A flexible silicone gasket with high thermal conductivity, prepared according to the following steps:

[0059] (1) Pretreatment of alumina particles: 2 parts by weight of silane coupling agent are dissolved in ethanol with a mass concentration of 95% to form a solution with a mass concentration of 15%, and stirred until the coupling agent is completely dissolved; 500 parts by weight The large spherical alumina particles were added to the silane coupling agent alcohol solution, stirred for 2 hours, dried at 150°C for 2h, and then dried at 200°C for 1h to obtain modified large spherical alumina particles, respectively The same method is used to modify the medium and small particles, and put them in a dry box for later use.

[0060] (2) Add 100 parts by weight of vinyl silicone oil and 50 parts by weight of simethicone oil into the container, stir evenly, and then add 1000 parts by weight of three kinds of modified spherical alumina particles with different particle sizes....

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PUM

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Abstract

The invention discloses a high-heat-conductivity flexible silica gel gasket and a preparation method thereof. The high-heat-conductivity flexible silica gel gasket is prepared from the following raw materials by weight: 600 to 1,000 parts of modified spherical aluminum oxide powder, 60 to 100 parts of vinyl silicone oil, 30 to 50 parts of dimethyl silicone oil, 1.5 to 4 parts of hydrogen-containing silicone oil and 0.2 to 0.8 part of catalyst. The preparation method comprises the following steps: (1) modifying aluminum oxide particles, (2) stirring; (3) vacuumizing, (4) vulcanizing, and the like. The high-heat-conductivity flexible silica gel gasket increases the heat-conducting channels in the silica gel gasket by modifying the spherical aluminum oxide powder, selecting the raw materials and controlling the using amount of the raw materials so as to improve the flexibility and the heat-conducting property of the silica gel gasket. The high-heat-conductivity flexible silica gel gasket has high flexibility, and the heat-conducting coefficient is increased by more than 4.2 W.

Description

[0001] technical field [0002] The invention relates to a silica gel gasket and a preparation method thereof, in particular to a highly thermally conductive flexible silica gel gasket and a preparation method thereof. [0003] Background technique [0004] With the development of science and technology, electronic components are becoming more and more dense and miniaturized, which puts forward higher requirements for the stability of electronic devices. The reliability and performance of electronic products depend to a large extent Whether the heat dissipation material and heat dissipation scheme adopted are reasonable. The rapid development of information technology has put forward high packaging and high reliability requirements for electronic devices. Thermal failure is the main factor for electronic packaging failure, accounting for more than 50%. According to statistics, every 2°C increase in the temperature of electronic components, its The reliability drops by 10%,...

Claims

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Application Information

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IPC IPC(8): C08L83/07C08L83/04C08L83/05C08K9/06C08K7/18C08K3/22C08J3/24
Inventor 谢佑南
Owner SHENZHEN HFC SHIELDING PRODS CO LTD
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